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Autor:
Mohan Nagar, A. Bansal, Choi HangChul, John Savic, Raj Pendse, Weidong Xie, Lee SangHo, Park Gun Oh, Mudasir Ahmad, David Senk, Nokibul Islam
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
High speed network packaging solutions have pushed the limits of known manufacturing technology into previously untested realms. Next generation ASIC's and SiP/MCM's are requiring packages in excess of 60mm × 60mm. These large package sizes present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e767c3bfb6ed51c9e726d7199350272
https://doi.org/10.1109/ectc.2012.6248870
https://doi.org/10.1109/ectc.2012.6248870
