Výsledky vyhledávání - "Park, Seungbae"

Akademický článek

Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review

Autor: Lai, Yangyang, Pan, Ke, Park, Seungbae

Publikováno v: In Microelectronics Reliability October 2024 161

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Akademický článek

Reflow profiling with the aid of machine learning models

Autor: Lai, Yangyang, Park, Seungbae

Publikováno v: Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 5, pp. 257-264.

Externí odkaz: http://www.emeraldinsight.com/doi/10.1108/SSMT-03-2023-0013

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Dissertation/ Thesis

Scientific realism vs. scientific antirealism

Autor: Park, Seungbae

According to Boyd/Putnam, scientific realism is the view that successful theories are typically approximately true and that their key terms typically refer. The no-miracle argument for the view holds that approximate truth and reference provide the b

Externí odkaz: http://hdl.handle.net/10150/289710

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Report

Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology

Autor: Cao, Shun, Parviziomran, Irandokht, Srihari, Krishnaswami, Park, Seungbae, Won, Daehan

The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, because the shift is considered to be negligibly small and the following

Externí odkaz: http://arxiv.org/abs/2002.07807

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Report

Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression

Autor: Cao, Shun, Parviziomran, Irandokht, Yang, Haeyong, Park, Seungbae, Won, Daehan

In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste with some fluid properties could slump and the unbalance between differen

Externí odkaz: http://arxiv.org/abs/2002.01527

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Report

Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology

Autor: Parviziomran, Irandokht, Cao, Shun, Yang, Haeyong, Park, Seungbae, Won, Daehan

Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are permanently attached on PCB with the aim of reflow soldering process. Dur

Externí odkaz: http://arxiv.org/abs/2001.09612

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