Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Parikshit Kulkarni"'
Publikováno v:
Photomask Technology 2020.
As fabs continue their effort to sustain Moore’s Law and manufacture smaller and more complex features in lithographic masks, Mask Process Correction (MPC) becomes increasingly more relevant. An indispensable part of MPC is the ability to accuratel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ded663b0d8e9e5d69af0510257b9efa7
https://doi.org/10.1117/12.2573108
https://doi.org/10.1117/12.2573108
Publikováno v:
Photomask Technology 2020.
Deep neural networks (DNN) have shown excellent performance in classification and regression problems in multiple fields. Recent work has demonstrated the use of deep learning techniques for modeling mask processes (MILAN) where it greatly reduces th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b604f4d6e2a656c6986f4ad1bbd245de
https://doi.org/10.1117/12.2573032
https://doi.org/10.1117/12.2573032
Autor:
Kokoro Kato, Fabian Saso, Sebastian Munoz, John Valadez, Kohei Yanagisawa, Kiyoshi Kageyama, Parikshit Kulkarni, Kota Kobayashi
Publikováno v:
Photomask Technology 2019.
Model Based Mask Process Correction (MB-MPC) has been deployed in the photomask manufacturing process for almost a decade. It has now become a must have process for leading edge masks that require high level manufacturing accuracy. Recently, aggressi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f48d7413538ad868a7f2444543958dc
https://doi.org/10.1117/12.2538626
https://doi.org/10.1117/12.2538626
Publikováno v:
Photomask Technology 2019.
Deriving models for lithographic masks based either on first principles or using an empirical model is becoming increasingly challenging as complex effects (once relegated to noise level) become more relevant. Deep Learning offers an alternative solu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e096f15e772bd8685042747ef10c5065
https://doi.org/10.1117/12.2536545
https://doi.org/10.1117/12.2536545
Autor:
Kota Kobayashi, Alex Zepka, Kiyoshi Kageyama, Kohei Yanagisawa, Parikshit Kulkarni, John Valadez
Publikováno v:
Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology.
Mask Process Correction (MPC) is becoming increasingly relevant as the industry moves toward more challenging technology nodes. Because running MPC on large layouts can be extremely resource intensive, it is important to strike a balance between the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ff62406cdb58940cef610adc01cbc55
https://doi.org/10.1117/12.2535707
https://doi.org/10.1117/12.2535707
Publikováno v:
Computer-Aided Design and Applications. 12:1-8
Given a set of axis-aligned rectangles in the plane, this paper presents an algorithm for the removal of rectangle containment as well as rectangle enclosures. That is, given a query rectangle Rq, this algorithm removes all rectangles Rk, … , Rl fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb259e5cb4923e0a877574024bff922b
https://doi.org/10.1080/16864360.2014.949566
https://doi.org/10.1080/16864360.2014.949566
Publikováno v:
Proceedings of CAD'14.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb0c3ed690ebe5dbbf76024dba217437
https://doi.org/10.14733/cadconfp.2014.19-21
https://doi.org/10.14733/cadconfp.2014.19-21
Publikováno v:
Proceedings of CAD'14.
There has been much attention on sophisticated algorithm design to compute geometric arrangements with both time and space efficiency. The issue of robustness and reliability has also been the subject of some interest, although mostly at the level of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f88ecd3ca26d2e42f575d96c607136a0
https://doi.org/10.14733/cadconfp.2014.31-33
https://doi.org/10.14733/cadconfp.2014.31-33
Publikováno v:
SPIE Proceedings.
Traditionally, Mask Data Preparation (MDP) flow for Variable Shape E-Beam (VSB) writers has been optimized in a generic fashion to minimize slivers and reduce shot count while maintaining data symmetry. To date, this approach has been sufficient and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38b4e3ba503ea07657db6b1d4610d23e
https://doi.org/10.1117/12.864159
https://doi.org/10.1117/12.864159
Publikováno v:
Journal of Computing & Information Science in Engineering; Dec2014, Vol. 14 Issue 4, p041002-041002-11, 1p