Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Paolo Colpani"'
Publikováno v:
Advanced Electronic Materials, Vol 4, Iss 12, Pp n/a-n/a (2018)
Abstract In the path toward the integration of organic field‐effect transistors (OFETs) and logic circuits into low‐cost and mass produced consumer products, all‐organic devices based on printed semiconductors are one of the best options to mee
Externí odkaz:
https://doaj.org/article/095bd5a699ab47309af099be201c7e7c
Autor:
Mario Caironi, Paolo Colpani, Giorgio Dell'Erba, Fabrizio Antonio Viola, Dario Natali, Biagio Brigante, Virgilio Mattoli
Publikováno v:
Advanced materials (Deerfield Beach, Fla.). 32(33)
The increasing diffusion of portable and wearable technologies results in a growing interest in electronic devices having features such as flexibility, lightness-in-weight, transparency, and wireless operation. Organic electronics is proposed as a po
Autor:
Francesco Pipia, Fabio Scime, M. Alessandri, Simona Spadoni, Paolo Colpani, Ivan Venegoni, Enrica Ravizza
Publikováno v:
Solid State Phenomena. 255:265-269
Electroless Ni deposition is often used in presence of Cu, Ti and Au. Recently TiW has also started to be employed, but with this alloy the Ni deposition is not always neat. In our work we investigate the effect of different wet treatments on the Ni
Autor:
Francesco Pipia, Luisito Livellara, Manuela Caminati, Maurizio Moroni, S. Grasso, Enrica Ravizza, Annamaria Votta, Maddalena Bollin, Simona Spadoni, M. Alessandri, Paolo Colpani
Publikováno v:
Solid State Phenomena. 255:270-276
Up to date, it is commonly reported in literature that the amount of copper hillocks is dependent on a) the total amount of residual Cu oxide after Cu CMP, and b) the Cu nitridation. The present work describes how that is only partially true: hillock
Autor:
Ivan Venegoni, Paolo Colpani, Simona Spadoni, Matteo Consonni, Mario Pistoni, S. Grasso, Enrica Ravizza, Irene Bianchi
Publikováno v:
Solid State Phenomena. 219:241-244