Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Pancheri NM"'
Autor:
Dhanabalan KM; Department of Bioengineering, Indian Institute of Science, Bengaluru, India, 560012. rachit@iisc.ac.in., Padhan B; Department of Bioengineering, Indian Institute of Science, Bengaluru, India, 560012. rachit@iisc.ac.in., Dravid AA; Department of Bioengineering, Indian Institute of Science, Bengaluru, India, 560012. rachit@iisc.ac.in., Agarwal S; Department of Bioengineering, Indian Institute of Science, Bengaluru, India, 560012. rachit@iisc.ac.in., Pancheri NM; Phil and Penny Knight Campus for Accelerating Scientific Impact, Department of Bioengineering, University of Oregon, Eugene, OR, USA, 97403., Lin A; Phil and Penny Knight Campus for Accelerating Scientific Impact, Department of Bioengineering, University of Oregon, Eugene, OR, USA, 97403., Willet NJ; Phil and Penny Knight Campus for Accelerating Scientific Impact, Department of Bioengineering, University of Oregon, Eugene, OR, USA, 97403., Padmanabhan AK; Department of Orthopaedics, MS Ramaiah Medical College, Bengaluru, India, 560054., Agarwal R; Department of Bioengineering, Indian Institute of Science, Bengaluru, India, 560012. rachit@iisc.ac.in.
Publikováno v:
Journal of materials chemistry. B [J Mater Chem B] 2024 Nov 06; Vol. 12 (43), pp. 11172-11186. Date of Electronic Publication: 2024 Nov 06.
Autor:
Pancheri NM; Department of Chemical & Biological Engineering, University of Idaho, Moscow, Idaho, USA., Ellingson AJ; Department of Chemical & Biological Engineering, University of Idaho, Moscow, Idaho, USA., Marchus CR; Department of Chemical & Biological Engineering, University of Idaho, Moscow, Idaho, USA., Durgesh V; Department of Mechanical Engineering, University of Idaho, Moscow, Idaho, USA., Verhage T; Department of Chemical & Biological Engineering, University of Idaho, Moscow, Idaho, USA., Yensen N; Department of Chemical & Biological Engineering, University of Idaho, Moscow, Idaho, USA., Schiele NR; Department of Chemical & Biological Engineering, University of Idaho, Moscow, Idaho, USA.
Publikováno v:
Stem cells and development [Stem Cells Dev] 2024 Jul; Vol. 33 (13-14), pp. 355-364. Date of Electronic Publication: 2024 Jun 20.
Autor:
Pancheri NM; Chemical & Biological Engineering, University of Idaho, Moscow, ID 83844, United States., Daw JT; Mechanical & Biomedical Engineering, Boise State University, Boise, ID 83725, United States., Ditton D; Chemical & Biological Engineering, University of Idaho, Moscow, ID 83844, United States., Schiele NR; Chemical & Biological Engineering, University of Idaho, Moscow, ID 83844, United States., Birks S; Mechanical & Biomedical Engineering, Boise State University, Boise, ID 83725, United States., Uzer G; Mechanical & Biomedical Engineering, Boise State University, Boise, ID 83725, United States., Jones CL; Mechanical & Biomedical Engineering, Boise State University, Boise, ID 83725, United States., Penney BT; Mechanical & Biomedical Engineering, Boise State University, Boise, ID 83725, United States., Theodossiou SK; Mechanical & Biomedical Engineering, Boise State University, Boise, ID 83725, United States.
Publikováno v:
BioRxiv : the preprint server for biology [bioRxiv] 2023 Nov 13. Date of Electronic Publication: 2023 Nov 13.
Autor:
Ellingson AJ, Pancheri NM, Schiele NR; Chemical and Biological Engineering, University of Idaho, 875 Perimeter Dr. MS 0904, Moscow, ID, USA.gaskon.ibarretxe@ehu.eus.
Publikováno v:
European cells & materials [Eur Cell Mater] 2022 Apr 05; Vol. 43, pp. 130-152. Date of Electronic Publication: 2022 Apr 05.
Autor:
Marchus CRN; University of Idaho, Department of Chemical & Biological Engineering, Moscow, ID, United States., Knudson JA; University of Idaho, Department of Chemical & Biological Engineering, Moscow, ID, United States., Morrison AE; University of Idaho, Department of Electrical and Computer Engineering, Moscow, ID, United States., Strawn IK; University of Idaho, Department of Chemical & Biological Engineering, Moscow, ID, United States., Hartman AJ; University of Idaho, Department of Electrical and Computer Engineering, Moscow, ID, United States., Shrestha D; University of Idaho, Department of Chemical & Biological Engineering, Moscow, ID, United States., Pancheri NM; University of Idaho, Department of Chemical & Biological Engineering, Moscow, ID, United States., Glasgow I; University of Idaho, Department of Mechanical Engineering, Moscow, ID, United States., Schiele NR; University of Idaho, Department of Chemical & Biological Engineering, Moscow, ID, United States.
Publikováno v:
HardwareX [HardwareX] 2021 Dec 18; Vol. 11, pp. e00253. Date of Electronic Publication: 2021 Dec 18 (Print Publication: 2022).
Autor:
Theodossiou SK; Biological Engineering, University of Idaho, 875 Perimeter Drive, MS 0904, Moscow, ID 83844., Pancheri NM; Biological Engineering, University of Idaho, 875 Perimeter Drive, MS 0904, Moscow, ID 83844., Martes AC; Psychology, Idaho State University, 921 South 8th Avenue Stop 8112, Pocatello, ID 83209., Bozeman AL; Psychology, Idaho State University, 921 South 8th Avenue Stop 8112, Pocatello, ID 83209., Brumley MR; Psychology, Idaho State University, 921 South 8th Avenue Stop 8087, Pocatello, ID 83209., Raveling AR; Biological Engineering, University of Idaho, 875 Perimeter Drive, MS 0904, Moscow, ID 83844., Courtright JM; Biological Engineering, University of Idaho, 875 Perimeter Drive, MS 0904, Moscow, ID 83844., Schiele NR; Biological Engineering, University of Idaho, 875 Perimeter Drive, MS 0904, Moscow, ID 83844.
Publikováno v:
Journal of biomechanical engineering [J Biomech Eng] 2021 Jun 01; Vol. 143 (6).