Zobrazeno 1 - 10
of 80
pro vyhledávání: '"Panart Khajornrungruang"'
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 18, Iss 4, Pp JAMDSM0049-JAMDSM0049 (2024)
Some nanoscale technologies are being employed without a full understanding of the underlying phenomena. Both static and dynamic observations of nanoparticles are essential for investigating these phenomena. While there are several methods for static
Externí odkaz:
https://doaj.org/article/61893d92a8ec455d867fe7ba16ffa6e2
Autor:
Yutaka Terayama, Panart Khajornrungruang, Jihoon Seo, Satomi Hamada, Yutaka Wada, Hirokuni Hiyama
Publikováno v:
Applied Sciences, Vol 14, Iss 18, p 8145 (2024)
It has been difficult to detach abrasive particles smaller than 50 nm from polished surfaces in post-CMP cleaning. During the cleaning process, the residual nano-particles exert shear force in the inevitable shear flow. In order to understand the cle
Externí odkaz:
https://doaj.org/article/e55d6c3ddcbb4d9a868de5a07b1588d4
Publikováno v:
International Journal of Automation Technology. 15:831-841
Total internal reflection is an optical imaging technique for nanoparticle tracking and observation employing the scattered light from an evanescent field near the interface or reference surface. Generally, the nanoparticle behavior is the three-dime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::994a3eb032e7e8a9a61f4c2043e364d3
https://doi.org/10.20965/ijat.2021.p0831
https://doi.org/10.20965/ijat.2021.p0831
Publikováno v:
Journal of Nanofluids. 10:420-430
The materials used in base fluids and nanoparticles are varied. One- and two-step manufacturing processes are used to create stable and highly conductive nanofluids. Both methods for making nanoparticle suspensions suffer from nanoparticle agglomerat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d099053b36fbff876cdcd736a9943101
https://doi.org/10.1166/jon.2021.1791
https://doi.org/10.1166/jon.2021.1791
Autor:
Yuki Tanaka, Edmund Soji Otabe, Tatsuya Nakasaki, Tatsuhiro Tanaka, Panart Khajornrungruang, Hidetaka Nakashima, Keisuke Suzuki, Yushi Kinoshita
Publikováno v:
International Journal of Automation Technology. 15:234-242
Superconductive-assisted machining (SUAM) is a polishing method that employs a magnetic levitation tool, which is based on a superconductive phenomenon called the pinning effect. Since the tool magnetically levitates, the issue of tool interference i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c48d7d942d998639c3fc94f17d61cc8
https://doi.org/10.20965/ijat.2021.p0234
https://doi.org/10.20965/ijat.2021.p0234
Publikováno v:
Journal of Materials Research. 36:258-267
We extend our recent 2D trajectory (x–y plane) and diffusion coefficient data of ceria particles near a glass surface obtained at pH 3, 5, and 7 using evanescent wave microscopy and video imaging to 3D trajectories by analyzing the separation dista
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0937dfa9e20e67c864a628043802b20b
https://doi.org/10.1557/s43578-020-00067-4
https://doi.org/10.1557/s43578-020-00067-4
Autor:
Akshay Gowda, Satomi Hamada, Suryadevara V. Babu, Jihoon Seo, Panart Khajornrungruang, Taeseup Song
Publikováno v:
Journal of Materials Research. 35:321-331
Using evanescent wave (EW)–based optical detection methods coupled with video microscopy, we investigated in situ trajectories, diffusion, and interaction energies of ∼140 nm ceria particles near a glass surface at pH 3, 5, and 7. Trajectories of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3fdaa5a3adb6e7efaa187041d9c5117
https://doi.org/10.1557/jmr.2020.6
https://doi.org/10.1557/jmr.2020.6
Autor:
Satomi Hamada, Yutaka Terayama, Panart Khajornrungruang, Kohei Kusatsu, Hirokuni Hiyama, Keisuke Suzuki, Yutaka Wada
Publikováno v:
ECS Transactions. 92:191-197
Cleaning process is indispensable in Post chemical mechanical polishing (Post-CMP) to remove the abrasive nano-particles remaining on the polished wafer surface. There are two main types of the cleaning process. One is contact cleaning with polyvinyl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::524e29b15ef7a77e32946ab8c113132b
https://doi.org/10.1149/09202.0191ecst
https://doi.org/10.1149/09202.0191ecst
Autor:
Yutaka Terayama, Panart Khajornrungruang, Keisuke Suzuki, Ryotaro Mori, Satomi Hamada, Yutaka Wada, Hirokuni Hiyama
Publikováno v:
ECS Meeting Abstracts. :1243-1243
In recent years, abrasive nanoparticles (sub Φ50 nm) have been applied in Chemical Mechanical Polishing (CMP) process to realize flattened surface of substrate for multilayer wiring structure and fine wiring width to achieve high performance Large S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1d82c3d4d595be0315073b0c784c3c0e
https://doi.org/10.1149/ma2022-01281243mtgabs
https://doi.org/10.1149/ma2022-01281243mtgabs
Publikováno v:
Extended Abstracts of the 2020 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3b48f7d68bdf70659f09152712797ac
https://doi.org/10.7567/ssdm.2020.c-2-07
https://doi.org/10.7567/ssdm.2020.c-2-07