Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Panagiotis I. Karkanas"'
Autor:
Panagiotis I. Karkanas, R. J. Freemantle, D.J. Dare, M. E. Unwin, R. E. Challis, D.L. Chadwick, Ivana K. Partridge
Publikováno v:
Journal of Applied Polymer Science. 88:1665-1675
This article presents a comparison of data obtained from a low-temperature cure of an epoxy/amine system by three independent cure monitoring techniques: ultrasonic wave propagation, dielectric permittivity, and nuclear magnetic resonance. The sizes
Publikováno v:
Journal of Applied Polymer Science. 77:2178-2188
The glass transition temperature (Tg) advancement and the chemoviscosity development under isothermal conditions have been investigated for four epoxy/amine systems, including commercial RTM6 and F934 resins. Differential scanning calorimetry (DSC) w
Publikováno v:
Polymer International. 41:183-191
An analytical procedure has been developed for modelling the kinetics of the cure process of a commercial epoxy resin for resin transfer moulding (RTM) applications, using differential scanning calorimetry (DSC) in the isothermal and dynamic modes to
Autor:
N. Kouloumbi, Ioanna Kyriopoulou, Panagiotis I. Karkanas, G.M. Tsangaris, Alexandros A. Skordos
Publikováno v:
Scopus-Elsevier
ResearcherID
ResearcherID
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a0ba96a8079a765c7f01b776780ab475
http://www.scopus.com/inward/record.url?eid=2-s2.0-0029506396&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-0029506396&partnerID=MN8TOARS
Publikováno v:
ResearcherID
The development, analysis and experimental validation of a novel flow and cure sensor for use in the resin transfer moulding of composites are presented. A linear relationship is established between the flow front position in the mould and electrical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f6f2c63636c9a5a7062465966d1f939e
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000085268700006&KeyUID=WOS:000085268700006
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000085268700006&KeyUID=WOS:000085268700006