Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Pamela Maurey"'
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:129-136
In this work the influence of annealing dwell time and temperature, as well as post-annealing thermal processing treatment on copper (Cu) protrusion in Cu through-glass vias (TGVs) were studied. The Cu TGVs were made in Corning HPFS Fused Silica subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6fe51b9de729efa89ea8feee3be2ce3
https://doi.org/10.1109/tdmr.2021.3059227
https://doi.org/10.1109/tdmr.2021.3059227
Publikováno v:
Microelectronics Reliability. 137:114783
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40d15d2a9c98f0737d21d722cfece705
https://doi.org/10.1016/j.microrel.2022.114783
https://doi.org/10.1016/j.microrel.2022.114783