Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Pamela Maurey"'
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:129-136
In this work the influence of annealing dwell time and temperature, as well as post-annealing thermal processing treatment on copper (Cu) protrusion in Cu through-glass vias (TGVs) were studied. The Cu TGVs were made in Corning HPFS Fused Silica subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6fe51b9de729efa89ea8feee3be2ce3
https://doi.org/10.1109/tdmr.2021.3059227
https://doi.org/10.1109/tdmr.2021.3059227
Publikováno v:
Microelectronics Reliability. 137:114783
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40d15d2a9c98f0737d21d722cfece705
https://doi.org/10.1016/j.microrel.2022.114783
https://doi.org/10.1016/j.microrel.2022.114783
Publikováno v:
IEEE Transactions on Device & Materials Reliability; Mar2021, Vol. 21 Issue 1, p129-136, 8p
Publikováno v:
LEOS 2001. 14th Annual Meeting of the IEEE Lasers & Electro-Optics Society (Cat. No.01CH37242); 2001, p228-228, 1p
Autor:
Manuel E. Brito, Peter Filip, Charles A. Lewinsohn, Ali Sayir, Mark Opeka, William M. Mullins
Over 40 papers are included in this volume from six symposia held during the 29th International Conference on Advanced Ceramics and Composites. Topics include ceramics and environmental applications, characterization tools for materials in extreme en
