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pro vyhledávání: '"Palash, V."'
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Publikováno v:
Journal of Cardiovascular and Thoracic Research, Vol 14, Iss 2, Pp 138-140 (2022)
Isolated tricuspid valve endocarditis accounts for only 5 to 10 percent of infective endocarditis cases globally. Numerous surgical procedures ranging from simple vegetectomy, creation of neoleaflets or complete replacement by a prosthetic valve have
Externí odkaz:
https://doaj.org/article/b85ada83e4cd434091413e3773ac104c
Autor:
Kar, Aritra a, Bhati, Awan a, Acharya, Palash V. a, Mhadeshwar, Ashish b, Venkataraman, Pradeep c, Barckholtz, Timothy A. b, Bahadur, Vaibhav a, ⁎
Publikováno v:
In Chemical Engineering Science 28 April 2021 234
Autor:
Acharya, Palash V., Bahadur, Vaibhav ⁎
Publikováno v:
In Fluid Phase Equilibria 15 February 2021 530
We account for the presence of surface charges towards describing variations in the dynamic contact angle of an advancing liquid-gas meniscus. Starting from the thin-film based formalism, we present closed-form analytical expressions relating the dyn
Externí odkaz:
http://arxiv.org/abs/1509.03010
Autor:
Rajeeva, Bharath Bangalore 1, Kunal, Pranaw 2, 7, Kollipara, Pavana Siddhartha 3, Acharya, Palash V. 3, Joe, Minwoong 1, 4, Ide, Matthew S. 5, Jarvis, Karalee 6, Liu, Yuanyue 1, 3, Bahadur, Vaibhav 3, Humphrey, Simon M. 2, Zheng, Yuebing 1, 3, 6, 8, ∗
Publikováno v:
In Matter 4 December 2019 1(6):1606-1617
Autor:
Acharya, Palash V., Bahadur, Vaibhav ⁎
Publikováno v:
In Advances in Colloid and Interface Science January 2018 251:26-43
Autor:
Timothy Andrew Barckholtz, Vaibhav Bahadur, Palash V. Acharya, Pradeep Venkataraman, Aritra Kar, Filippo Mangolini, Awan Bhati, Ashish B. Mhadeshwar, Hugo Celio
Publikováno v:
ACS Sustainable Chemistry & Engineering. 9:11137-11146
Autor:
Palash V. Acharya, Abdelhamid Ouroua, Manojkumar Lokanathan, Robert E. Hebner, Vaibhav Bahadur, Shannon Strank
Publikováno v:
Proceedings of the IEEE. 109:1364-1397
Dielectric materials with high thermal conductivity (TC) can enable disruptive performance enhancement in the areas of electronics packaging, thermal management, energy storage, cabling, and heat sinks. There have been widespread global efforts over
Autor:
Abdelhamid Ouroua, Vaibhav Bahadur, Palash V. Acharya, Robert E. Hebner, Manojkumar Lokanathan, Shannon Strank
Publikováno v:
Journal of Electronic Packaging. 143
Machine learning (ML)-based predictive techniques are used in conjunction with a game-theoretic approach to predict the thermal behavior of a power electronics package, and study the relative influence of encapsulation material properties and thermal