Zobrazeno 1 - 10
of 90
pro vyhledávání: '"Package testing"'
Autor:
Kyle Dunno, Purushottam Chavan
Publikováno v:
Vibration, Vol 5, Iss 4, Pp 792-802 (2022)
Crowdsourced logistics has emerged as a delivery channel for many single-parcel packages. As a result, this logistics network has introduced personal passenger vehicles as a means to transport parcels during last mile delivery segments. To understand
Externí odkaz:
https://doaj.org/article/d0ecc87c6ef84760a0b6df29d2bc7da2
There is a high dependency on accurate finite element models in the packaging industry for concept selection, design and virtual validation of packages. One of themost used materials for these packages is High-Density Polyethylene (HDPE). Thismateria
Externí odkaz:
http://urn.kb.se/resolve?urn=urn:nbn:se:bth-24806
Publikováno v:
Cybernetics and Information Technologies, Vol 15, Iss 1, Pp 84-103 (2015)
An important step in the development of a Real-Time Operating System (RTOS) is the validation of its tolerance properties. An abnormal input (fault injection) has become one of the most efficient ways to test the software robustness. In this paper we
Externí odkaz:
https://doaj.org/article/8fd77cb2d0d348cb9a9797ef08f25e82
Autor:
Wei Lin, Feiyu Kang, Cheng Yang, Sum Wai Chiang, Jiaman Liu, Yingying Luo, Peng Liu, Ching-Ping Wong, Dang Wu, Wanyu Dai
Publikováno v:
ACS Applied Materials & Interfaces. 13:15791-15801
Future electronic packaging technology requires semiconductor chips having a larger size and higher power for advanced applications, e.g., new energy conversion systems, electric vehicles, and data center servers, yet traditional thermal interface ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e392431a44da5a57010a4cfef4c78d9f
https://doi.org/10.1021/acsami.0c22434
https://doi.org/10.1021/acsami.0c22434
Autor:
Péter Majoros, Ágnes Takács
Publikováno v:
Multidiszciplináris Tudományok. 9:64-67
Napjainkban világszerte egyre jellemzőbb az online vásárlás, melynek köszönhetően a csomagszállítás egyre nagyobb méreteket ölt. Elengedhetetlen az áruk védelme és a vevők elégedettsége érdekében a megfelelő csomagolás biztosí
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3c5691ebd85900611f959c833950c6f
https://doi.org/10.35925/j.multi.2019.3.6
https://doi.org/10.35925/j.multi.2019.3.6
Akademický článek
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Akademický článek
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An Efficient Test Architecture for Concurrent Over Voltage Stress Testing (OVST) of Logic and Memory
Publikováno v:
2021 IEEE International Test Conference India (ITC India).
Many of the latent defects in modern day SoCs don't get activated at the time of final package tests carried out under Adaptive Voltage Scaling (AVS) and rated functional operating frequencies. As a result, chips with latent defects too pass the fina
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b13ffe3a876be2cb65de1c60dbea5ac7
https://doi.org/10.1109/itcindia52672.2021.9532907
https://doi.org/10.1109/itcindia52672.2021.9532907
Publikováno v:
Socio-Economic Planning Sciences. 66:136-148
Considering the interrelationships between periods and the influences of non-operational factors, a new framework based generalized three-stage DEA model, grey relational analysis theory and disparity disassembly model is proposed in this paper. Then
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c44b5a0f650a1b105269fb6dab467a2
https://doi.org/10.1016/j.seps.2018.07.007
https://doi.org/10.1016/j.seps.2018.07.007
Publikováno v:
UbiComp
Smart packaging adds sensing abilities to traditional packages. This paper investigates the possibility of using RF signals to test the internal status of packages and detect abnormal internal changes. Towards this goal, we design and implement a non
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6d3660ab193ac84a25b3136436d9cf2d
https://doi.org/10.1109/tmc.2018.2852637
https://doi.org/10.1109/tmc.2018.2852637