Zobrazeno 1 - 10
of 76
pro vyhledávání: '"PIL-HO LEE"'
Publikováno v:
Virtual and Physical Prototyping, Vol 19, Iss 1 (2024)
Aerosol Jet Printing (AJP) is a digital direct ink writing technology, which excels in maskless patterning and fine conductive line deposition. However, its potential in droplet-based printing remains largely unexplored, which presents a unique oppor
Externí odkaz:
https://doaj.org/article/8599048c59cc49eeb173070e15367648
Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 69, Iss No 2, Pp 395-400 (2024)
Additive manufacturing is an innovative manufacturing process that enables complex topological structures and low-volume, high-variety production. One of the major adaptations of this method is in the tire industry. Thin-walled sipes slit the tires t
Externí odkaz:
https://doaj.org/article/5887c0a16c164976b00380ec1ec16144
Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 69, Iss No 2, Pp 401-405 (2024)
Efforts to miniaturize and customize electronic devices have attracted considerable amounts of attention in many industrial fields. Recently, due to its innovative printing technology with the capability of printing fine features onto non-planar subs
Externí odkaz:
https://doaj.org/article/c98c22df7a2f456eae043c202a38d13c
Autor:
Bibek Poudel, Partick Kwon, Haseung Chung, Guangchao Song, Chenhui Shao, Hoa Nguyen, Pil-Ho Lee, Kyoungho Jung, Kayoung Kim
Publikováno v:
International Journal of Precision Engineering and Manufacturing-Green Technology. 9:1411-1426
Magnetic-field assisted finishing (MAF) is a surface finishing process that utilizes a flexible brush composed of iron and abrasive particles typically mixed in a liquid medium. This paper presents an innovative approach to enhance the MAF performanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::590a21f3272ce60cda2cddfc845f384e
https://doi.org/10.1007/s40684-021-00404-w
https://doi.org/10.1007/s40684-021-00404-w
Autor:
Young-Chan Jang, Pil-Ho Lee
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 67:2672-2676
A 3.0 GSymbol/s/lane transceiver bridge chip, which fully supports the mobile industry processor interface (MIPI) C-PHY version 1.1 specification, is proposed for field-programmable gate array (FPGA)-based pattern generators and frame grabbers. In tr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::181e38aa402d0fc5e7eadf51a677d89b
https://doi.org/10.1109/tcsii.2019.2962839
https://doi.org/10.1109/tcsii.2019.2962839
Publikováno v:
2022 International Conference on Electronics, Information, and Communication (ICEIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6b5f1024be1153410f8698b52e85c9c
https://doi.org/10.1109/iceic54506.2022.9748322
https://doi.org/10.1109/iceic54506.2022.9748322
Autor:
Sang-jae Rhee, Junghoon Jin, Ki-hwan Choi, Seungjun Kim, Sunguk Choi, Jongsun Kim, Pil-Ho Lee
Publikováno v:
2021 18th International SoC Design Conference (ISOCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a338336420376263d8ffa743583642d
https://doi.org/10.1109/isocc53507.2021.9613940
https://doi.org/10.1109/isocc53507.2021.9613940
Autor:
Young-Chan Jang, Pil-Ho Lee
Publikováno v:
IEEE Transactions on Consumer Electronics. 65:484-492
A 20-Gbps receiver bridge chip featuring auto-skew calibration and continuous-time linear equalization is proposed to support the mobile industry processor interface D-PHY version 2.0 specification with four data lanes and one clock lane. The propose
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a16684d895bce228ba30951f9de8c7a
https://doi.org/10.1109/tce.2019.2942503
https://doi.org/10.1109/tce.2019.2942503
Autor:
Jae Hyuk Choi, Jung Sub Kim, Chang Su Lee, Haseung Chung, Pil-Ho Lee, Sung-Min Kim, Sang Won Lee
Publikováno v:
Journal of Composite Materials. 54:607-615
This paper explores the characteristics of a new lightweight thermoplastic composite filament filled with hollow glass beads developed for material extrusion additive manufacturing. Compounding experiments, which mix hollow glass beads with neat acry
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7be3fc77617ac000a276775424a9e005
https://doi.org/10.1177/0021998319863836
https://doi.org/10.1177/0021998319863836
Autor:
Pil-Ho Lee, Young-Chan Jang
Publikováno v:
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences. :783-787
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::932dbf1dc9ebd2905511c991a0acb9d9
https://doi.org/10.1587/transfun.e102.a.783
https://doi.org/10.1587/transfun.e102.a.783