Zobrazeno 1 - 10
of 184
pro vyhledávání: '"P.T. Lee"'
Publikováno v:
Journal of Materials Research and Technology, Vol 11, Iss , Pp 1895-1910 (2021)
Intermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstr
Externí odkaz:
https://doaj.org/article/e3e1564139424e4b892e43183728ab85
Publikováno v:
Journal of Materials Research and Technology, Vol 9, Iss 6, Pp 12946-12954 (2020)
Metallurgical systems containing substantial amounts of metallic indium have always been very challenging to investigate due to the difficulties involved with sample characterization caused by the substantial softness of indium. Such difficulties are
Externí odkaz:
https://doaj.org/article/32a5257f1b034bb08dd524a77c1b389a
Publikováno v:
Journal of Materials Research and Technology, Vol 11, Iss, Pp 1895-1910 (2021)
Intermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::261428fdc8dc6c688a26c262600f7685
http://www.sciencedirect.com/science/article/pii/S2238785421001551
http://www.sciencedirect.com/science/article/pii/S2238785421001551
Publikováno v:
Surface and Coatings Technology. 359:374-383
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b6a0f1f482ec661821e70b9eb06c03f
https://doi.org/10.1016/j.surfcoat.2018.12.043
https://doi.org/10.1016/j.surfcoat.2018.12.043
Publikováno v:
Surface and Coatings Technology. 350:1010-1019
Pinhole formation in electroplated Cu has been a critical reliability issue in developing through-/blind-hole (TH/BH) metallization with a thin surface-Cu feature. A mechanism of the pinhole formation has been recently proposed in a previous study, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2cc5eb7dc22c739df84a6634ea102e1
https://doi.org/10.1016/j.surfcoat.2018.02.075
https://doi.org/10.1016/j.surfcoat.2018.02.075
Publikováno v:
Applied Surface Science. 434:1353-1360
Thermal reliability of Au/Pd/Cu and Au/Pd(4–6 wt.% P)/Cu trilayers in the isothermal annealing at 180 °C were investigated by X-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectrometry (TOF-SIMS), and transmission elect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f9dbadc3430f7b0f2eb0f7cb3dc72a6
https://doi.org/10.1016/j.apsusc.2017.11.247
https://doi.org/10.1016/j.apsusc.2017.11.247
Publikováno v:
Journal of The Electrochemical Society. 165:D647-D653
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6804879944c934f714799840ff3a2d50
https://doi.org/10.1149/2.1001813jes
https://doi.org/10.1149/2.1001813jes
Akademický článek
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Akademický článek
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Publikováno v:
Surface and Coatings Technology. 320:559-567
The effects of the plating current density ( j ) on the electroplated Cu microstructure, impurity distribution, and the solderability of the electroplated Cu were investigated. Analyses of electron backscatter diffraction and transmission electron mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32e90eee71d15f916979c069a21630d0
https://doi.org/10.1016/j.surfcoat.2016.11.016
https://doi.org/10.1016/j.surfcoat.2016.11.016