Zobrazeno 1 - 10
of 79
pro vyhledávání: '"P.K. Mozumder"'
Publikováno v:
IEEE Transactions on Electron Devices. 45:626-633
Recently, work has been started on a new methodology, called process synthesis, that has the potential to revolutionize integrated circuit (IC) process design in the same way that ASIC and microelectronics manufacturing science and technology (MMST)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4cbbe12c7d22614f185a99cf92663b5
https://doi.org/10.1109/16.661224
https://doi.org/10.1109/16.661224
Autor:
P.P. Apte, Sharad Saxena, R. Burch, Joseph C. Davis, Karthik Vasanth, P.K. Mozumder, S. Rao, C. Fernando
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 11:527-536
Run-to-run and supervisory control algorithms determine the equipment recipe to produce a desired output wafer state given the incoming wafer state and the current equipment model. For simple, low-dimensional equipment models, this problem is not dif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5db94b5a3b704c2eb7ac4029a0285ec7
https://doi.org/10.1109/66.728548
https://doi.org/10.1109/66.728548
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 11:583-590
In this paper, we present techniques that can be used to answer the following two questions: (1) how many wafers need to be allocated per treatment to detect a given difference in a device performance metric and (2) how can one determine if a given t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae22f29fea4a195ada3c9aa67b45b895
https://doi.org/10.1109/66.728555
https://doi.org/10.1109/66.728555
Autor:
Jye-Chyi Lu, P.K. Mozumder, H.H. Heinisch, E.A. Rying, B.E. Hornung, S. Rao, Joseph C. Davis, R.S. Gyurcsik, Jimmie J. Wortman, M.M. Gardner
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C. 20:295-304
This paper describes a new methodology for equipment fault detection. The key features of this methodology are that it allows for the incorporation of spatial information and that it can be used to detect and diagnose equipment faults simultaneously.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::003ac0511066d514751c75c3b6e7f04c
https://doi.org/10.1109/3476.650961
https://doi.org/10.1109/3476.650961
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 9:366-383
An advanced multivariable in-line process control system, which combines traditional statistical process control (SPC) with feedback control, has been applied to the CVD tungsten process on an Applied Materials reactor. The goal of the model-based co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05de0161311feedef782e7a88bf4778f
https://doi.org/10.1109/66.536109
https://doi.org/10.1109/66.536109
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 9:128-135
Present day semiconductor manufacturing processes are subject to tight specifications. High yields with tight process specifications require drive to target process control. As the size of the wafer in the semiconductor industry increases, nonuniform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0995d3203f09da20fa79d55e1f620440
https://doi.org/10.1109/66.484293
https://doi.org/10.1109/66.484293
Autor:
P.K. Mozumder, A. Chatterjee
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 9:437-446
We present a novel design for manufacturing (DFM) methodology that has been applied to the design of a pass transistor for 256 Mbit DRAM. The design inputs that include gate oxide thickness, which limits the booted wordline voltage, the threshold vol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15b560d4adad5e46c48e25b7b13d64b1
https://doi.org/10.1109/66.536114
https://doi.org/10.1109/66.536114
Autor:
P.K. Mozumder, Duane S. Boning
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 7:233-244
Rapid modeling and optimization of manufacturing processes, devices, and circuits are required to support modern integrated circuit technology development and yield improvement. We have prototyped and applied an integrated system, called DOE/Opt, for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf8a78730473dd7651e1b514d2bd0fc4
https://doi.org/10.1109/66.286858
https://doi.org/10.1109/66.286858
Autor:
W.C. Dietrich, V.T. Rajan, M.E. Law, R.H. Wang, G.R. Chin, P.K. Mozumder, M.D. Giles, M.S. Karasick, L.R. Nackman, D.M.H. Walker, A.S. Wong, Duane S. Boning
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 13:82-95
This work describes the Semiconductor Wafer Representation (SWR) for representing and manipulating wafer state during process and device simulation. The goal of the SWR is to provide an object-oriented interface to a collection of functions designed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6955a4da38b1996b68abd62a6e220bd
https://doi.org/10.1109/43.273747
https://doi.org/10.1109/43.273747
Autor:
G.G. Barna, P.K. Mozumder
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 7:1-11
This paper presents the methodology developed for the automatic feedback control of a silicon nitride plasma etch process. The methodology provides an augmented level of control for semiconductor manufacturing processes, to the level that the operato
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f25c10f65db0c075e4cf682eefef137
https://doi.org/10.1109/66.286826
https://doi.org/10.1109/66.286826