Zobrazeno 1 - 3
of 3
pro vyhledávání: '"P. V. Plunkett"'
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 4:471-475
A packaged large-scale integrated (LSI) chip or hybrid destined for military or space applications must pass the gambit of screens listed in Method 5004 of MIL-STD-883B. These screens include the particle impact noise detection (PIND) test in which a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cd5d1facb19e71a971136936d2a72e5
https://doi.org/10.1109/tchmt.1981.1135818
https://doi.org/10.1109/tchmt.1981.1135818
Publikováno v:
19th International Reliability Physics Symposium.
Packaged LSI and hybrid devices used in high reliability military and space applications must pass a rigorous series of screens defined by Method 5004 of Mil Standard 883B. One of these screens is the Particle Impact Noise Detection (PIND) test. This
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb513359a009cf608481a07bdf5a9f2f
https://doi.org/10.1109/irps.1981.362989
https://doi.org/10.1109/irps.1981.362989
Autor:
H. B. Bonham, P. V. Plunkett
Publikováno v:
Surface Contamination ISBN: 9781468435085
Many authors have discussed the detrimental results of surface contamination upon thermocompression bondability. The problem is acute when gold-aluminum intraconnections are formed, since most wet chemical cleaning procedures degrade bondability furt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2a878ea450e41f3d1d455a9dac51a21
https://doi.org/10.1007/978-1-4684-3506-1_18
https://doi.org/10.1007/978-1-4684-3506-1_18
