Výsledky vyhledávání - "P. T. Vianco"

Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer. Part 2: Quantitative Compositional Analysis of Intermetallic Compound Reaction Layers

Autor: P. T. Vianco, A. C. Kilgo, B. B. McKenzie, R. P. Grant, S. Williams

Publikováno v: Journal of Electronic Materials. 52:628-652

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7ebba358aa167b03304579e405c60c37
https://doi.org/10.1007/s11664-022-10034-w

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Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions

Autor: P. T. Vianco, A. C. Kilgo, B. M. McKenzie, R. L. Grant, S. Williams

Publikováno v: Journal of Electronic Materials. 51:6431-6453

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4d7f68f3f9d717069826ce7495ff9538
https://doi.org/10.1007/s11664-022-09880-5

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Robustness and Versatility of Thin Films on Low Temperature Cofired Ceramic (LTCC)

Autor: J. A. Wolf, P. T. Vianco, S. Goldammer, Kenneth A. Peterson, M. H. Johnson

Publikováno v: International Symposium on Microelectronics. 2011:000559-000565

Thin film multilayers have previously been introduced on multilayer low temperature cofired ceramic (LTCC). The ruggedness of a multipurpose Ti-Cu-Pt-Au stack has continued to benefit fabrication and reliability in state-of-the-art modules. Space opt

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1591f2315771780744cc21bddeeffff4
https://doi.org/10.4071/isom-2011-wa3-paper6

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Development of Alternatives to Pb-Based Solders

Autor: P. T. Vianco, F. G. Yost, D. R. Frear, J. L. Roberts

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::17e168d0399e80fdb776bba2e229fe24
https://doi.org/10.2172/770407

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Effect of tensile stress on the annealed structure of a metallic glass

Autor: P. T. Vianco, Jian Li

Publikováno v: Journal of Materials Research. 2:461-470

The low-temperature (120°–245°C) structural relaxation of Metglas¯ 2826B (Ni49Fe29P14B6Si2) amorphous alloy was investigated for samples subjected to a tensile stress in the range of 20–400 MPa during annealing. The stress-annealed samples dem

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bdabc9e337c52c2710475f63f7ab5bbb
https://doi.org/10.1557/jmr.1987.0461

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Annealing of shear bands in metallic glasses

Autor: P. T. Vianco, Jian Li

Publikováno v: Journal of Materials Science. 22:3129-3138

Shear bands introduced into the as-quenched metallic glass alloy, MetglasR 2826 (Fe40Ni40P14B6), were etched by immersion in a solution of CUS04 and HCI. Elimination of the etchability property through isothermal annealing had an apparent activation

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8999e41aad1438683b8ef532e0cc682c
https://doi.org/10.1007/bf01161173

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