Zobrazeno 1 - 10
of 181
pro vyhledávání: '"P. Markondeya Raj"'
Akademický článek
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Autor:
Akeeb Hassan, Sepehr Soroushiani, Abdulhameed Abdal, Sk Yeahia Been Sayeed, Wei-Chiang Lin, Markondeya Raj Pulugurtha
Publikováno v:
IEEE Open Journal of Nanotechnology, Vol 3, Pp 52-60 (2022)
Embedded-chip planar silver-elastomer interconnect technology is developed with flexible substrates and demonstrated for on-skin biophotonic sensor applications. This approach has several benefits and is also consistent with chip-thinning where the c
Externí odkaz:
https://doaj.org/article/b2381df992cf4f92af8c7aedb2bf197f
Autor:
Sk Yeahia Been Sayeed, Ghaleb Al Duhni, Hooman Vatan Navaz, John L. Volakis, Markondeya Raj Pulugurtha
Publikováno v:
Sensors, Vol 23, Iss 14, p 6441 (2023)
Wireless passive neural recording systems integrate sensory electrophysiological interfaces with a backscattering-based telemetry system. Despite the circuit simplicity and miniaturization with this topology, the high electrode–tissue impedance cre
Externí odkaz:
https://doaj.org/article/32053230246945988ec35843baf892a5
Akademický článek
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Autor:
Ghaleb Al-Duhni, Ghaleb Saleh, Hasan, Muhammad Mahmudul, Pala, Nezih, Pulugurtha, Markondeya Raj
Publikováno v:
Nanotechnology Magazine; 2024, Vol. 18 Issue: 2 p10-20, 11p
Akademický článek
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Autor:
Rao Tummala, Satoshi Hachiya, Keiji Takemura, Himani Sharma, Teng Sun, P. Markondeya Raj, Furukawa Yoshihiro
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:134-141
Integrated power conversion and delivery are the key to achieve high-efficiency and high-performance data processing. Power inductors with high power density and low dc resistance are the key enabler to realize miniaturized voltage regulators (VRs) w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c0e7c6cc7729b2982076c4e22c5a9c7
https://doi.org/10.1109/tcpmt.2019.2956528
https://doi.org/10.1109/tcpmt.2019.2956528
Autor:
Vanessa Smet, Ninad Shahane, Rao Tummala, Chintan Buch, P. Markondeya Raj, Chandrasekharan Nair
Publikováno v:
IEEE Nanotechnology Magazine. 12:6-18
The trends to high-density, ultrathin, and low-cost electronic systems are currently changing the face of the mobile, security, health-care, and automotive industries. Providing a flexible platform extends the applicability of these next-generation c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0f073a783e49583577fe54894b6f547
https://doi.org/10.1109/mnano.2018.2869235
https://doi.org/10.1109/mnano.2018.2869235
Publikováno v:
2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting.
We present methods to improve the flexibility of fabric integrated RF structures by modifying solder contacts to epoxy based interconnects. Specifically, we assess the loss exhibited by two textile-based transmission lines (TLs) using interconnects m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fe95b560066db489a4d06775fcc4f49
https://doi.org/10.1109/ieeeconf35879.2020.9330329
https://doi.org/10.1109/ieeeconf35879.2020.9330329
Autor:
Takenori Kakutani, Siddharth Ravichandran, Muhammad Ali, Rui Zhang, Rao Tummala, Atom Watanabe, P. Markondeya Raj, Madhavan Swaminathan
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Chip-embedded mm-wave antenna-integrated modules are demonstrated, for the first time, on panel-scale ultra-thin glass substrates, for high-speed 5G communication standards in the n257 band (26.5 – 29.5 GHz) defined by 3GPP. Co-packaging of amplifi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e65e1b1f77404854f392df501c0957d
https://doi.org/10.1109/ectc32862.2020.00027
https://doi.org/10.1109/ectc32862.2020.00027