Zobrazeno 1 - 10
of 33
pro vyhledávání: '"P. C. Andricacos"'
Autor:
P. C. Andricacos
Publikováno v:
The Electrochemical Society Interface. 8:32-37
On-chip interconnections comprise a multilevel structure of fine wiring located on the top of the transistor circuitry of logic or memory chips, whose role is to connect circuits together as shown in Fig. 1. To avoid significant degradation of circui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d44eabbdf889755be10b9a3edb019ca5
https://doi.org/10.1149/2.f06991if
https://doi.org/10.1149/2.f06991if
Autor:
N. Robertson, P. C. Andricacos
Publikováno v:
IBM Journal of Research and Development. 42:671-680
The need for recording heads to write on high-coercivity media at high frequencies has created new requirements for the write-head material that cannot be met by Ni80Fe20, the nickel-iron alloy traditionally used in the fabrication of the device. Ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b2d368f087c25ad9836c09d9e6228bb
https://doi.org/10.1147/rd.425.0671
https://doi.org/10.1147/rd.425.0671
Publikováno v:
The Electrochemical Society Interface. 7:22-25
The hard work of three leading researchers was recently interrupted when I asked them to ponder the following question: “What, in your view, is an exciting, major development in electrodeposition over the last five years?” Believe it or not, they
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdafb55505813f81fc9f1ae5d34cc957
https://doi.org/10.1149/2.f05981if
https://doi.org/10.1149/2.f05981if
Autor:
John Owen Dukovic, Ravindra Vaman Shenoy, Christopher V. Jahnes, P. C. Andricacos, Hariklia Deligianni, H.M. Tong, Madhav Datta, H Nye, Lubomyr T. Romankiw, Birenda Nath Agarwala, Jeffrey Frederick Roeder, J. Horkans, P. Totta
Publikováno v:
Journal of The Electrochemical Society. 142:3779-3785
Electrochemical fabrication of PbSn C4s (controlled collapse chip connection) offers significant cost, reliability, and environmental advantages over the currently employed evaporation technology. A continuous seed layer is required for through-mask
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e9ddd3f7d900b1f9504bead8f3f2c67
https://doi.org/10.1149/1.2048413
https://doi.org/10.1149/1.2048413
Publikováno v:
Journal of The Electrochemical Society. 142:2244-2249
Underpotential deposition of Pb or Sn on Cu can be used to produce electroplated Cu‐Pb and Cu‐Sn alloys, with small amounts of alloyed Pb and Sn, from acid solutions that do not contain complexants. Such alloys are of interest as possible on‐ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71a79f298650bcdad130b88f57bd6a80
https://doi.org/10.1149/1.2044281
https://doi.org/10.1149/1.2044281
Autor:
P. C. Andricacos
Publikováno v:
Journal of The Electrochemical Society. 142:1824-1828
A technique that makes use of a rotating ring-disk electrode has been developed for the composition determination of NiCo alloys. Because of its low cost and ease of use, the technique is ideally suited for the study of NiCo plating solutions. Follow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79ee5e302dfc9950bdb47eaf3d904486
https://doi.org/10.1149/1.2044200
https://doi.org/10.1149/1.2044200
Publikováno v:
Journal of The Electrochemical Society. 140:3497-3505
The effect of lithographic patterning on electrodeposit thickness uniformity was investigated in a series of experiments. Copper was electrodeposited from an acid‐sulfate solution onto a specially patterned cathode under controlled agitation provid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58713d74dde59a3875b33a26b55c836b
https://doi.org/10.1149/1.2221118
https://doi.org/10.1149/1.2221118
Publikováno v:
Journal of The Electrochemical Society. 140:959-965
Research was carried out in part at beamline X23A2 at the National Synchrotron Light Source, Brookhaven National Laboratory, which is supported by the U.S. Department of Energy, Division of Materials Sciences and Division of Chemical Sciences. H.S.I.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a70f7750a7388cc5233542039c016d8
https://doi.org/10.1149/1.2056235
https://doi.org/10.1149/1.2056235
Publikováno v:
IBM Journal of Research and Development. 37:97-106
A rotating ring-disk stripping technique has been used to analyze Sn-Pb alloys plated from methane sulfonic acid solutions with and without a proprietary additive and to construct associated current-potential curves. The deposition of both pure Sn an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d18cebb2414e898e53f083e87ab506d0
https://doi.org/10.1147/rd.372.0097
https://doi.org/10.1147/rd.372.0097
Publikováno v:
Journal of The Electrochemical Society. 139:78-91
A model has been developed to predict current distribution in electrodeposition onto substrates that contain lithographic patterns. The aim of the work was to understand the strong effects that substrate patterning can exert on the thickness distribu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::926aab3932a56d0dbc8f45fcde29277d
https://doi.org/10.1149/1.2069205
https://doi.org/10.1149/1.2069205