Zobrazeno 1 - 10
of 43
pro vyhledávání: '"P. Bancken"'
Autor:
Rika Bajorat, Lena Danckert, Florian Ebert, Theresa Bancken, Stefan Bergt, Felix Klawitter, Brigitte Vollmar, Daniel A. Reuter, Tobias Schürholz, Johannes Ehler
Publikováno v:
Biomedicines, Vol 11, Iss 3, p 855 (2023)
The synthetic antimicrobial peptides (sAMPs) Pep19-2.5 and Pep19-4LF have been shown in vitro and in vivo to reduce the release of pro-inflammatory cytokines, leading to the suppression of inflammation and immunomodulation. We hypothesized that inter
Externí odkaz:
https://doaj.org/article/e0404ec78d3d4737afb1f40bd99349ba
Akademický článek
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Autor:
Jiri Jakovenko, J. M. G. Kunen, Xavier Jordà, P. Bancken, R.J. Werkhoven, P.J. Bolt, Xavier Perpiñà, Miquel Vellvehi
Publikováno v:
IEEE Transactions on Power Electronics. 34:3677-3688
Several thermal management strategies for LED drivers designed for high lumen retrofit LED lamps are studied by simulation and experimentation means. Depending on the driver output, two scenarios are analyzed: Low voltage–high current (18 V–620 m
Akademický článek
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Autor:
J. M. G. Kunen, R.J. Werkhoven, Miquel Vellvehi, X. Jorda, Xavier Perpiñà, P. Bancken, Jiri Jakovenko, P.J. Bolt
Publikováno v:
IEEE Transactions on Power Electronics, 7, 30, 3876-3891
This paper studies the thermal influence of a light-emitting diode (LED) driver on a retrofit LED lamp, also reporting on a procedure for its thermal characterization and multiscale modeling. In this analysis, temperature is measured by infrared ther
Akademický článek
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Autor:
Xavier Perpiñà, Miquel Vellvehi, Xavier Jordà, J. Formanek, J. M. G. Kunen, Adrien Gasse, R.J. Werkhoven, Jiri Jakovenko, P.J. Bolt, Miroslav Husak, P. Bancken
Publikováno v:
Microelectronics Reliability, 8, 53, 1076-1083
This work presents a comparison of various LED board technologies from thermal, mechanical and reliability point of view provided by an accurate 3-D modelling. LED boards are proposed as a possible technology replacement of FR4 LED boards used in 400
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc8a43fbe241586ed91f76a46deca8ed
http://resolver.tudelft.nl/uuid:4c52e409-45be-464a-a621-6a37608e0825
http://resolver.tudelft.nl/uuid:4c52e409-45be-464a-a621-6a37608e0825
Autor:
B. Pardo, Miquel Vellvehi, T. Van Weelden, A. Fargeix, P. Bancken, X. Jorda, Xavier Perpiñà, R.J. Werkhoven, Adrien Gasse, Jiri Jakovenko
Publikováno v:
Microelectronics Reliability, 8, 53, 1084-1094
In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ans
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3bae695320d5f782b676cdfa946c5ba1
http://resolver.tudelft.nl/uuid:98d16166-55fd-41f0-a5c0-c51bd1261b81
http://resolver.tudelft.nl/uuid:98d16166-55fd-41f0-a5c0-c51bd1261b81
Autor:
Xavier Perpiñà, Xavier Jordà, Jiri Jakovenko, J. M. G. Kunen, R.J. Werkhoven, P. Bancken, Miquel Vellvehi, P.J. Bolt
Publikováno v:
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, 25 September 2013 through 27 September 2013, Berlin, 381-384
This work deals with the extraction of key thermal parameters for accurate thermal modelling of LED lamps: air exchange coefficient around the lamp, emissivity and thermal conductivity of all lamp parts. As a case study, an 8W retrofit lamp is presen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bdf927b317faba5bc1d95a3499449544
http://resolver.tudelft.nl/uuid:af538e04-c80a-4b42-8a7d-f3ed9e918f35
http://resolver.tudelft.nl/uuid:af538e04-c80a-4b42-8a7d-f3ed9e918f35
Autor:
T. Van Weelden, B. Pardo, A. Fargeix, R.J. Werkhoven, P. Bancken, Adrien Gasse, Xavier Perpiñà, Jiri Jakovenko
Publikováno v:
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys