Zobrazeno 1 - 8
of 8
pro vyhledávání: '"P-L. Charvet"'
Autor:
D. Nouguier, Ahmad Bsiesy, Claire Fenouillet-Beranger, N. Rambal, Xavier Federspiel, Christophe Licitra, Patrice Gonon, C. Guerin, S. Beaurepair, P-L. Charvet, Névine Rochat, Marc Veillerot, D. Ney, Vincent Jousseaume
Publikováno v:
IEEE Int. Interconnect Technology Conference (IITC)
IEEE Int. Interconnect Technology Conference (IITC), 2018, Santa Clara, United States. pp 61-63
IEEE Int. Interconnect Technology Conference (IITC), 2018, Santa Clara, United States. pp 61-63
This work presents an in-depth study of the thermal stability of low-k material in view of intermediate Back-End-Of-Line (iBEOL) for 3D sequential Integration. SiOCH ULK were analyzed after thermal annealing up to 600°C. Moreover, the stability and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44ed5abbfb3f02f569e74ad568ea315a
https://hal.univ-grenoble-alpes.fr/hal-01942970
https://hal.univ-grenoble-alpes.fr/hal-01942970
Publikováno v:
Microelectronics Reliability. 53:1622-1627
The reliability of MEMS sensors or actuators such as accelerometers, gyroscopes, resonators, RF switches, microbolometers… is critically dependent on the vacuum level and on the nature of the gaseous species present inside the MEMS cavity (∼1 mm3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d678d857d93fbcdf0217f6a489719bd
https://doi.org/10.1016/j.microrel.2013.07.021
https://doi.org/10.1016/j.microrel.2013.07.021
Autor:
S. Danthon, S. Nicolas, G. Rodriguez, P. L. Charvet, S. Fanget, P. Nicolas, J. L. Pornin, D. Saint-Patrice, B. Savornin
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:002428-002482
Most of the time, MEMS devices require hermetic encapsulation for protection against atmosphere, moisture, particles and standard back-end manufacturing technologies. In the last few years, Wafer Level Packaging (WLP) is moving toward developments on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ecb1f26328ab03aa20435faa61f1eac
https://doi.org/10.4071/2012dpc-tha31
https://doi.org/10.4071/2012dpc-tha31
Autor:
Karima Amara, Pierre Nicolas, Renzo Dal Molin, Jean-Charles Souriau, Bertrand Boutaud, G. Parat, Philippe D'hiver, Laetitia Castagne, Gilles Simon, P. L. Charvet
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::827c1fe20a7df85a40ef374cd8fedb58
https://doi.org/10.1109/estc.2014.6962738
https://doi.org/10.1109/estc.2014.6962738
Autor:
B. Savornin, Elisabeth Blanquet, D. Saint Patrice, J. L. Pornin, P. L. Charvet, I. Nuta, X. Baillin, P. Nicolas
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
In the field of MEMS packaging technology the pressure limit inside the cavity is a crucial parameter. As the cavity size becomes smaller and smaller the vacuum is mainly affected by the outgassing of the materials used in the fabrication process. A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b426d29a6abe60e018a3d32e918da79
https://doi.org/10.1109/ectc.2013.6575772
https://doi.org/10.1109/ectc.2013.6575772
Autor:
Elisabeth Blanquet, P. L. Charvet, P. Nicolas, J. L. Pornin, D. Saint Patrice, B. Savornin, I. Nuta, X. Baillin
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2013, 107, pp.97-100. ⟨10.1016/j.mee.2012.12.002⟩
Microelectronic Engineering, Elsevier, 2013, 107, pp.97-100. ⟨10.1016/j.mee.2012.12.002⟩
International audience; In this paper, a new method to characterize materials outgassing behavior is detailed. The understanding of these phenomena during all the process steps is required to improve vacuum thin film packaging. Starting from a standa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4605e2b7fcca01f2f631a28a11b46b1f
https://hal.archives-ouvertes.fr/hal-00850232
https://hal.archives-ouvertes.fr/hal-00850232
Autor:
Nelly Bonifaci, F. Souchon, Olivier Lesaint, P.-L. Charvet, Alexis Peschot, Christophe Poulain
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, 2012, 52, pp.2261-2266
Microelectronics Reliability, Elsevier, 2012, 52, pp.2261-2266
Microelectronics Reliability, 2012, 52, pp.2261-2266
Microelectronics Reliability, Elsevier, 2012, 52, pp.2261-2266
The reliability of electrical contacts is now the major challenge to improve the lifetime of Micro Electro Mechanical Switches. This paper investigates contact failure due to material transfer in real MEMS devices. The mechanisms of degradation obser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::167b8a749ed46ea66797f527d993007a
https://hal.science/hal-00739465
https://hal.science/hal-00739465
Publikováno v:
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on, Apr 2006, como, Italy. pp.1-6
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on, Apr 2006, como, Italy. pp.1-6
International audience; This article presents a study of microswitches with piezoelectric actuation. With the help of analysis modelling and FEM commercial software (ANSYS), we investigated the potentiality of AlN as piezoelectric actuator. Firstly,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c99f51c5bfb38754c901ddb3cdfc55e3
https://hal.archives-ouvertes.fr/hal-00346961
https://hal.archives-ouvertes.fr/hal-00346961