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Akademický článek
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Autor:
Rohit Sharma, Vijendera Kumar, Bhyrav M. Mutnury, Sunil Pathania, Mallikarjun Vasa, Sukumar Muthusamy, P K Seema
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
At high-speeds, careful analysis is required at the design stage to ensure robust signal integrity (SI) in high-speed printed circuit boards (PCBs). Signal loss in PCBs is predominantly due to conductor loss, dielectric loss and impedance mismatch.In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6ba1d005acf14221d68a2d625a6e768
https://doi.org/10.1109/epeps48591.2020.9231336
https://doi.org/10.1109/epeps48591.2020.9231336
Autor:
Sunil Pathania, P K Seema, Sukumar Muthusamy, Rohit Sharma, Vijendera Kumar, Sanjay Kumar, Mallikarjun Vasa, Bhyrav M. Mutnury, Ashish Shrivastava
Publikováno v:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Historically, signal integrity (SI) modeling and analysis was performed standalone without considering non-electrical aspects of the design. Going forward, this approach may not be viable to model high-speed serial links. Increased demand for higher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::831ae63529f99dc2ba70a973367fbd95
https://doi.org/10.1109/edaps47854.2019.9011670
https://doi.org/10.1109/edaps47854.2019.9011670