Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Oswaldo Chacon"'
Publikováno v:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV, Feb 2019, San Francisco, SPIE, pp.12, 2019, ⟨10.1117/12.2504649⟩
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV, Feb 2019, San Francisco, SPIE, pp.12, 2019, ⟨10.1117/12.2504649⟩
Laser grooving is a powerful method widely used in the semiconductor industry for chip singulation because of the advantages it provides, such as high grooves profile quality, lower mechanical stresses on devices. Nevertheless, challenges related to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8b2622b4ed99cb5f9f25683bd17bee88
https://doi.org/10.1117/12.2504649
https://doi.org/10.1117/12.2504649
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), May 2019, Las Vegas, IEEE, pp.1396-1404, 2019, ⟨10.1109/ECTC.2019.00215⟩
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), May 2019, Las Vegas, IEEE, pp.1396-1404, 2019, ⟨10.1109/ECTC.2019.00215⟩
The highly complex technology requirements of today's integrated circuits (ICs), lead to the increasingly use of several materials types such as metal structures, brittle dielectrics, porous low-k and ultra-low-k materials which are used in both fron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b58f940b6a6126a86af13dcebc593f0b
https://hal.archives-ouvertes.fr/hal-02453586
https://hal.archives-ouvertes.fr/hal-02453586
Autor:
Thomas A. Wassick, John P. Cincotta, Oswaldo Chacon, Theo Anemikos, Hugues Gagnon, Robert Martel, Charles Carey, Samantha Donavan, Zhuo-Jie Wu, Patrick Justison, Doug Hunt
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
To enable higher computing power in a single chip, there is demand for increasing die size for high performance applications in advanced nodes. Due to the weak mechanical properties of the low-k and ultra low-k (ULK) dielectrics in advanced technolog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::827d306934b3c59182bc6a6e98937ffe
https://doi.org/10.1109/ectc.2018.00104
https://doi.org/10.1109/ectc.2018.00104
Publikováno v:
International Symposium on Microelectronics. 2012:000110-000118
Pb-Free BGA solder joints are more brittle and more susceptible to interfacial fails than the leaded versions. These brittle failures typically occur if the modules are subjected to high strain rates through module handling impacts or PCB flexural st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9f952b9b9924fdb84fcea6c54c0fe08
https://doi.org/10.4071/isom-2012-ta42
https://doi.org/10.4071/isom-2012-ta42
Publikováno v:
Multidisciplinary Business Review, Vol 14, Iss 1 (2021)
El propósito de este artículo es dilucidar la noción de desempeño (firm performance) en las escuelas más representativas de la administración estratégica (Strategic Management) y contribuir mediante una definición y un modelo conceptual integ
Externí odkaz:
https://doaj.org/article/8195cac49e95485f9895bc058929efbd
Autor:
MARIO CRUZ VELAZQUEZ
Publikováno v:
Universidad Autónoma de Chiapas
UNACH
Repositorio Institucional de la Universidad Autónoma de Chiapas
UNACH
Repositorio Institucional de la Universidad Autónoma de Chiapas
Esta investigación tiene como objeto de estudio un tema específico; los procedimientos de asignación de la representación proporcional en la integración de las legislaturas del estado de Chiapas en los últimos quince años de gobierno. Los proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______3056::9bcfa4f106340aa939f6d8131d91dfc1
http://www.repositorio.unach.mx/jspui/handle/123456789/3032
http://www.repositorio.unach.mx/jspui/handle/123456789/3032