Zobrazeno 1 - 10
of 114
pro vyhledávání: '"Osamu OHNISHI"'
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 42, Iss 6, Pp 637-649 (2022)
Wide-band-gap semiconductors such as silicon carbide, gallium nitride, and diamond are known as hard-to-process materials. In this study, two types of chemical mechanical polishing (CMP)-related processing equipment were designed to create novel high
Externí odkaz:
https://doaj.org/article/527951fee8244ef9bfc9332f909ec3a4
Real-Time Evaluation of Tool Flank Wear by In-Process Contact Resistance Measurement in Face Milling
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 6, Iss 6, Pp 958-970 (2012)
This paper reports in-process detection of tool wear by using tool-work thermo-electromotive force (E.M.F.) as a sensor signal in face milling. In the case of using a single cutting edge, E.M.F. at the beginning of cut increased slowly corresponding
Externí odkaz:
https://doaj.org/article/1a83de4ee9a444b7831a22ec4b9bf2d9
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 6, Iss 2, Pp 206-221 (2012)
The wear resistance of coating films on hob teeth is investigated through the simulated hobbing tests with a flytool. The coating films on hob teeth are titanium family ceramics such as TiN, TiCN, TiSiN and TiAlN and aluminum chromium family ceramics
Externí odkaz:
https://doaj.org/article/30eab45f541e46a8893a0b7ad0d3150e
Publikováno v:
Precision Engineering. 63:18-32
In this study, a system for measuring small-sized holes with a 17–21 mm diameter and 1000 mm length was constructed. The system comprises a laser interferometer to detect hole accuracy, a probe connected to a measurement bar, and an optical apparat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6f1aa8d6196686cf2791a38d44e5d9d
https://doi.org/10.1016/j.precisioneng.2019.12.012
https://doi.org/10.1016/j.precisioneng.2019.12.012
Autor:
Toshiro Doi, Yuki Kugimoto, Osamu Ohnishi, Atsumi Wakabayashi, Syuhei Kurokawa, Toshiaki Dobashi
Publikováno v:
Progress in Organic Coatings. 92:80-84
The main aim of the present study is to manufacture antistatic sheets with high transparency and high electrical conductivity by dip coating. Here, we used coating solutions consisting of a quaternary ammonium salt, a urethane acrylate oligomer, a ph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc495fd8f284d76c4de277accccf5279
https://doi.org/10.1016/j.porgcoat.2015.11.013
https://doi.org/10.1016/j.porgcoat.2015.11.013
Autor:
Ji Zhang, Terutake Hayashi, Yasuhisa Sano, Asakawa Eiji, Syuhei Kurokawa, Cheng Wu Wang, Koki Ohyama, Toshiro Doi, Michio Uneda, Osamu Ohnishi, Hideo Aida
Publikováno v:
Applied Mechanics and Materials. :458-462
In this paper, lapped C-face of single crystal SiC wafer was irradiated by femtosecond laser. Chemical mechanical polishing (CMP) was then carried out to polish the irradiated SiC C-face. The authors compared the results of femtosecond laser-assisted
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b25b315c6fb8ace6fe603500ff0d1733
https://doi.org/10.4028/www.scientific.net/amm.799-800.458
https://doi.org/10.4028/www.scientific.net/amm.799-800.458
Autor:
Hideo Aida, Toshiro Doi, Michio Uneda, Yasuhisa Sano, Kazuto Yamauchi, Hiroaki Nishikawa, Osamu Ohnishi, Yuu Okada, Syuhei Kurokawa
Publikováno v:
Key Engineering Materials. 625:550-553
Plasma chemical vaporization machining (PCVM) is a high-speed plasma etching method using atmospheric-pressure plasma. Although it does not leave an affected layer on the processed surface because of the small ion energy owing to the small mean free
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a14057a5a31d1525f1cb2a3ab133c973
https://doi.org/10.4028/www.scientific.net/kem.625.550
https://doi.org/10.4028/www.scientific.net/kem.625.550
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 79:2546-2557
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::813214ddf42013b0af2471752cf4b77b
https://doi.org/10.1299/kikaic.79.2546
https://doi.org/10.1299/kikaic.79.2546
Publikováno v:
Advanced Materials Research. :1131-1134
In order to achieve high removal rate and high-quality processing on SiC wafer, we carried out the CMP processing experiment with the new type CMP machine (Bell-jar) by using the slurry with the addition of strong oxidant (KMnO4). It was found that t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc9168df63b2cad626e8e9f1d5179085
https://doi.org/10.4028/www.scientific.net/amr.591-593.1131
https://doi.org/10.4028/www.scientific.net/amr.591-593.1131
Publikováno v:
Journal of Manufacturing Processes. 14:224-232
The study focuses on the efforts for minimization of burr formation and improvement of hole surface roughness in micro through-hole machining. It deals with the development of micro compound tool which is consisting of a micro flat drill as the drill
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7d73453bb2939e9acaa0cc10677cfc5d
https://doi.org/10.1016/j.jmapro.2011.12.006
https://doi.org/10.1016/j.jmapro.2011.12.006