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pro vyhledávání: '"Organic solderability preservative"'
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Publikováno v:
Soldering & Surface Mount Technology, 2017, Vol. 29, Issue 2, pp. 99-109.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-05-2016-0010
Publikováno v:
Journal of Materials Research and Technology, Vol 11, Iss, Pp 1895-1910 (2021)
Intermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::261428fdc8dc6c688a26c262600f7685
http://www.sciencedirect.com/science/article/pii/S2238785421001551
http://www.sciencedirect.com/science/article/pii/S2238785421001551
Autor:
Yong-Ho Ko, Gyu-Won Jeong, Min-Su Kim, Han-Bo-Ram Lee, Jungsoo Kim, Seungju Baek, Junhyuk Son
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:3324-3333
Power modules are being increasingly used as essential parts in eco-friendly vehicles, and they are generally exposed to high temperatures during operation. To this end, electronic interconnection methods that can enhance durability and help withstan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de7f1e4d6fdcc1ebbeea7edc0163f942
https://doi.org/10.1007/s10854-020-05080-1
https://doi.org/10.1007/s10854-020-05080-1
Autor:
Jitrin Chaiprapa, N. R. Abdul Razak, Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, S. F. N. Muhd Amli, Mohd Izrul Izwan Ramli, Hideyuki Yasuda
Publikováno v:
Journal of Electronic Materials. 50:855-868
The effects of copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish reflowed on Sn-3.0Ag-0.5Cu (SAC305) solder have been investigated in detail. Besides conventional cross-sectional microstruc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1955e9d6fccb09761398d266dae92778
https://doi.org/10.1007/s11664-020-08641-6
https://doi.org/10.1007/s11664-020-08641-6
Autor:
Siti Farahnabilah Muhd Amli, Mohd Izrul Izwan Ramli, Nurul Razliana Abdul Razak, Mohd Arif Anuar Mohd Salleh
Publikováno v:
Sains Malaysiana. 49:3255-3259
The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb53397418494b15d878c15d1e897b02
https://doi.org/10.17576/jsm-2020-4912-36
https://doi.org/10.17576/jsm-2020-4912-36
Autor:
Flora Somidin, Kazuhiro Nogita, Hideyuki Yasuda, Z. Shayfull, Mohd Izrul Izwan Ramli, Jitrin Chaiprapa, S. F. N. Muhd Amli, Mohd Arif Anuar Mohd Salleh
Publikováno v:
Journal of Electronic Materials. 50:710-722
This study examines factor(s) behind the formation of primary Cu6Sn5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys are hypoeutectic. To understand the contribution from copper (Cu) dissolution from the substr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b991d98368c898e868228168cf32b3c
https://doi.org/10.1007/s11664-020-08428-9
https://doi.org/10.1007/s11664-020-08428-9
Autor:
Rick Nichols
Publikováno v:
Lead-free Soldering Process Development and Reliability
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64c6bef6053df5208d4f2823b6eb2650
https://doi.org/10.1002/9781119482093.ch8
https://doi.org/10.1002/9781119482093.ch8
Autor:
Jenq-Gong Duh, Collin Fleshman
Publikováno v:
Journal of Electronic Materials. 49:196-201
The correlations between different Ni contents in Sn-1.2Ag-0.5Cu-xNi (wt.%; x = 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8c2f3e85a3911646c7d55c096226e7d
https://doi.org/10.1007/s11664-019-07481-3
https://doi.org/10.1007/s11664-019-07481-3
Publikováno v:
Journal of Alloys and Compounds. 775:581-588
We investigated the effect of Ag-coated multi-walled carbon nanotubes (Ag-MWCNT) on the microstructures and electromigration behaviors of a Sn58%Bi solder and organic solderability preservative (OSP) surface finished on the FR-4 printed circuit board
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c499d226270bae4a0a45edb0a993332
https://doi.org/10.1016/j.jallcom.2018.10.028
https://doi.org/10.1016/j.jallcom.2018.10.028