Zobrazeno 1 - 10
of 84
pro vyhledávání: '"Orain, S."'
Publikováno v:
In Microelectronic Engineering 2006 83(11):2297-2302
Publikováno v:
In Microelectronic Engineering 2006 83(11):2402-2406
Publikováno v:
In Thin Solid Films 2001 389(1):167-172
Publikováno v:
In International Journal of Heat and Mass Transfer 2001 44(20):3973-3984
Publikováno v:
Journées Annuelles SF2M 2007
Journées Annuelles SF2M 2007, Jun 2007, France
Journées Annuelles SF2M 2007, Jun 2007, France
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::dcd1d6b7ce2000d4a6c9e92ce4ef1dc2
https://hal.archives-ouvertes.fr/hal-00194745
https://hal.archives-ouvertes.fr/hal-00194745
Autor:
Gallon, C., Fenouillet-Beranger, C., Vandooren, A., Bœuf, F., Monfay, S., Payet, F., Orain, S., Fiori, V., Salvetti, F., Loubet, N., Charbuillet, C., Toffoli, A., Allain, F., Cayrefourcq, I., Ghyselen, B., Mazure, C., Delille, D., Judong, F., Perrot, C., Hopstaken, M., Scheblin, P., Rivallin, P., Brevard, L., Faynot, O., Cristoloveanu, S., Skotnick, T.
Publikováno v:
Com. a 2006 IEEE Int. SOI Conf
Com. a 2006 IEEE Int. SOI Conf, 2006, Grenoble, France. pp.XX
Com. a 2006 IEEE Int. SOI Conf, 2006, Grenoble, France. pp.XX
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::aaedd21b534593dd59e4b9f122000829
https://hal.archives-ouvertes.fr/hal-00146905
https://hal.archives-ouvertes.fr/hal-00146905
Autor:
Grasser, Tibor, Selberherr, Siegfried, Populaire, C., Villanueva, D., Orain, S., Brillet-Rouxel, H.
Publikováno v:
Simulation of Semiconductor Processes & Devices 2007; 2007, p421-424, 4p
Publikováno v:
2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation Experiments in Microelectronics & Micro-Systems. EuroSime 2007; 2007, p1-9, 9p
Publikováno v:
2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation Experiments in Microelectronics & Micro-Systems. EuroSime 2007; 2007, p1-7, 7p
Publikováno v:
2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p256-263, 8p