Non-thermal plasma activation of BPDA-PPD polyimide for improved cell-material interaction

Autor: Astoreca, Laura, Cools, Pieter, Schaubroeck, David, Asadian, Mahtab, Aliakbarshirazi, Sheida, Declercq, Heidi, Op de Beeck, Maaike, Morent, Rino, De Smet, Herbert, De Geyter, Nathalie

Publikováno v: In Polymer 28 September 2020 205

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.

Polymer-based dry electrodes for high user comfort ECG/EEG measurements

Autor: Chen, Yun Hsuan, Op de Beeck, Maaike, Carrette, Evelien, Vanderheyden, Luc, Grundlehner, Bernard, Mihajloviü, Vojkan, Boon, Paul, van Hoof, Chris, Gessner, Thomas

Publikováno v: Smart Systems Integration-8th International Conference and Exhibition on Integration Issues of Miniaturized Systems-MEMS, NEMS, ICs and Electronic Components, SSI 2014, 329-336
STARTPAGE=329;ENDPAGE=336;TITLE=Smart Systems Integration-8th International Conference and Exhibition on Integration Issues of Miniaturized Systems-MEMS, NEMS, ICs and Electronic Components, SSI 2014

Conventional ECG and EEG gel electrodes are widely used in health care applications. These electrodes deliver high-quality signals due to their low impedance, but they have important drawbacks, such as time-consuming electrode set-up for EEG followed

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=narcis______::cc437a955eb683ac91b677fa163db83a
https://research.tue.nl/nl/publications/96f933d4-58c4-4177-b10a-f94c7d155666

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Autor: Sterken, Tom, Op de Beeck, Maaike, Vermeiren, Filip, Torfs, Tom, Wang, Liang, Priyabadini, Swarnakamal, Dhaenens, Kristof, Cuypers, Dieter, Vanfleteren, Jan

Publikováno v: IMAPS 2012 : proceedings of the 45th international symposium on microelectronics

Thinning down ICs is a well-known approach to reduce the volume of chip packages. In this work ICs are thinned down to 30um, followed by a package procedure in polyimide with copper fan out, which allows their embedding in adhesives used for laminati

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______330::f3509c48e6c7e5e42082dade0dae83ce
https://hdl.handle.net/1854/LU-3169473

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.