Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ooi, Eang Pang"'
Autor:
Ooi Eang Pang, Ruslizam Daud, Nasrul Amri Mohd Amin, Mohd Afendi Rojan, Mohd Shukry Abd Majid
Publikováno v:
Journal of Mechanical Engineering and Sciences, Vol 11, Iss 1, Pp 2478-2487 (2017)
A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness
Externí odkaz:
https://doaj.org/article/0890ccb6c6d24fb2826c65b1f0ae6b42
Publikováno v:
JOURNAL OF MECHANICAL ENGINEERING AND SCIENCES. 14:2478-2487
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdbf71278787c2da70df12a02bef8c17
https://doi.org/10.15282/jmes.11.1.2017.7.0228
https://doi.org/10.15282/jmes.11.1.2017.7.0228
Autor:
Ooi, Eang Pang, Daud, Ruslizam, Amin, N.A.M., Hong, T.W., Abdul Majid, M.S., Afendi, Mohd, Mohamad, Azizul, Ariffin, Ahmad Kamal
Publikováno v:
Applied Mechanics and Materials; August 2015, Vol. 786 Issue: 1 p131-135, 5p
Autor:
Ooi, Eang Pang, Daud, Ruslizam, Amin, N.A.M., Hong, T.W., Abdul Majid, M.S., Afendi, M., Mohamad, Azizul, Ariffin, Ahmad Kamal
Publikováno v:
Applied Mechanics and Materials; August 2015, Vol. 786 Issue: 1 p136-140, 5p