Zobrazeno 1 - 10
of 425
pro vyhledávání: '"Onushkin, A."'
Autor:
Belanger, Paul
Publikováno v:
International Review of Education / Internationale Zeitschrift für Erziehungswissenschaft / Revue Internationale de l'Education, 1997 Jan 01. 43(4), iii-iii.
Externí odkaz:
https://www.jstor.org/stable/3444828
Publikováno v:
In Measurement May 2020 156
Publikováno v:
In Microelectronics Reliability August 2018 87:89-96
Publikováno v:
Вестник Самарского университета: Аэрокосмическая техника, технологии и машиностроение, Vol 16, Iss 3, Pp 94-103 (2017)
A mathematical model of helicopter vertical takeoff was created. The model takes into account operating conditions and individual performance capabilities of a given helicopter. An optimization technique based on a genetic algorithm was introduced. T
Externí odkaz:
https://doaj.org/article/45c0aaa47b5d4ba2a471505041b136ae
Autor:
Altbach, Philip G.
Publikováno v:
Comparative Education Review, 1973 Feb 01. 17(1), 120-120.
Externí odkaz:
https://www.jstor.org/stable/1186871
Publikováno v:
Russian Aeronautics; Jan2022, Vol. 65 Issue 1, p121-131, 11p
Publikováno v:
Russian Aeronautics. 64:488-496
Autor:
Genevieve Martin, Christophe Marty, Robin Bornoff, Andras Poppe, Grigory Onushkin, Marta Rencz, Joan Yu
Publikováno v:
Energies, Vol 12, Iss 12, p 2389 (2019)
At present, when designing a Light Emitting Diode (LED) luminaire, different strategies of development are followed depending on the size of the company. Since on LED datasheets there is only limited information provided, companies designing LED lumi
Externí odkaz:
https://doaj.org/article/a3d6c72507fc4f14901de30eba4312b8
Publikováno v:
Energies, Vol 12, Iss 10, p 1860 (2019)
Thermal transient testing is widely used for LED characterization, derivation of compact models, and calibration of 3D finite element models. The traditional analysis of transient thermal measurements yields a thermal model for a single heat source.
Externí odkaz:
https://doaj.org/article/eb077a7c956d4287ae874c5f28182d87
Publikováno v:
Russian Aeronautics; Jul2021, Vol. 64 Issue 3, p488-496, 9p