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Publikováno v:
Journal of Vacuum Science & Technology A
Journal of Vacuum Science & Technology A, 2017, 35 (2), ⟨10.1116/1.4972228⟩
Journal of Vacuum Science and Technology A
Journal of Vacuum Science and Technology A, American Vacuum Society, 2017, 35 (2), ⟨10.1116/1.4972228⟩
Journal of Vacuum Science & Technology A, 2017, 35 (2), ⟨10.1116/1.4972228⟩
Journal of Vacuum Science and Technology A
Journal of Vacuum Science and Technology A, American Vacuum Society, 2017, 35 (2), ⟨10.1116/1.4972228⟩
The complexification of integrated circuit designs along with downscaling introduces new patterning challenges. In logic process integration, it is found that the gate etch process flow introduces a few nanometer displacement of the gate patterns fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dad21ce3c37bc58d16ddc4aadd0a0ac9
https://hal.univ-grenoble-alpes.fr/hal-01891224
https://hal.univ-grenoble-alpes.fr/hal-01891224
Autor:
B. Le-Gratiet, R. Bouyssou, B. Orlando, Alice Pelletier, Céline Lapeyre, Latifa Desvoivres, Alain Ostrovsky, J. Ducote, Jean Damien Chapon, Auguste Lam, Anna Szucs, Nicolas Chojnowski, Vincent Farys, Onintza Ros Bengoechea, J. Decaunes, Jean-Christophe Michel, Vincent Morin, C. Monget, Marc Mikolajczak, Frank Sundermann, Maxime Gatefait, Pascal Gouraud, Laurene Babaud, Jonathan Planchot, Emek Yesilada
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 14:021103
Patterning process control has undergone major evolutions over the last few years. Critical dimension, focus, and overlay control require deep insight into process-variability understanding to be properly apprehended. Process setup is a complex engin
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