Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ong Chen Ho"'
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Pre-plated leadframe (PPF) is usually plated with nickel-palladium plating, and the hardness of the plating is much higher than tin (Sn) plating. However, in some cases, it is observed that the PPF is more prone to damage that resulted in exposed cop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1acc1957881b96acbdb5fcef6aff9ae5
https://doi.org/10.1109/eptc.2017.8277530
https://doi.org/10.1109/eptc.2017.8277530
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Conventional method to define the useful tool life is by punching the actual molded units in trim and form (TNF) machine. Throughout the punch intervals, the punched leadframes were sent for inspection for any side burr observed at the leads. This pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c60c7da0db8130e5ab20d6751a2a5420
https://doi.org/10.1109/eptc.2016.7861489
https://doi.org/10.1109/eptc.2016.7861489
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Incoming wire bond capillary quality is critical for wire bond result consistency on production lines. The inconsistent capillary quality can cause abnormal capillary tip vibration distribution when ultrasonic power is applied. In this paper, a new n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc932d9d0ae77dc7baf5bd681ed84509
https://doi.org/10.1109/eptc.2015.7412276
https://doi.org/10.1109/eptc.2015.7412276
Autor:
Ong Chen Ho
Publikováno v:
36th International Electronics Manufacturing Technology Conference.
This paper demonstrates the capillary ultrasonic characterization methodology with laser Doppler vibrometer (LDV). Total five capillaries with different body designs with same tip dimensions were evaluated. Using the energy conservation theory, it is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1960c5de7f98c156d66d74fb2c484cfe
https://doi.org/10.1109/iemt.2014.7123071
https://doi.org/10.1109/iemt.2014.7123071
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Chip to chip Cu wire bonding studies have been carried out on TSLP package, with bare Cu and palladium coated copper (PCC) wire. This paper discusses on feasibility studies of Cu wire chip to chip bonding which include bump cut mode, scale lead setti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e10429960c3a38691596a114a47128dd
https://doi.org/10.1109/eptc.2013.6745709
https://doi.org/10.1109/eptc.2013.6745709
Autor:
Chua Choon Wee, Ong Chen Ho
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Ultrasonic vibration behavior of wire bonding capillaries was studied with laser vibrometer at free air and bonding stage. Vibration displacement was measured at transducer, capillary body and capillary tip at the interval of 1mm with Laser Doppler V
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a05709d78900888b290d681a2269dcfc
https://doi.org/10.1109/eptc.2012.6507088
https://doi.org/10.1109/eptc.2012.6507088