Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Ong, Siong Chiew"'
Autor:
Ong Siong Chiew, Hai-Yan Yang, Christina Lim, Herbert Schumann, He-Kuan Luo, Tan Xiang Jie, Lim Bee Khim
Publikováno v:
Journal of Molecular Catalysis A: Chemical. 261:112-119
Palladium(II) and platinum(II) Lewis acid catalysts bearing BINAP have been proved to be water-tolerant in enantioselective carbonyl-ene reactions, thus arylglyoxal monohydrate could be used directly as substrate achieving good to excellent enantiose
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82fee61ab21dc559cc27eaf52704522d
https://doi.org/10.1016/j.molcata.2006.07.068
https://doi.org/10.1016/j.molcata.2006.07.068
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
This paper will present the work developed for Copper Via Exposure to enable further processing on the backside of the wafer; re-distribution layer (RDL), passivation coating, etc. It important to achieve a planarized surface, as uneven silicon surfa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55043ee44bf98b32da07a17b70c861c8
https://doi.org/10.1109/eptc.2011.6184490
https://doi.org/10.1109/eptc.2011.6184490
Autor:
Ong Siong Chiew, Cheryl Sharmani, Hong Yu Li, N. Khan, Shekar Vasarala, Li Shiah Lim, David Ho Soon Wee
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Miniaturized 3D package with shorter distances between chips are needed for the mobile and high frequency applications. Chip-to-chip stacking for 3D packaging using conventional assembly method and single step reflow attachment is the most cost-effec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19fa5fbcf5422b259f534d5eac2a181e
https://doi.org/10.1109/ectc.2010.5490686
https://doi.org/10.1109/ectc.2010.5490686
Autor:
Won Kyoung Choi, Phyo Phyo Thaw, John H. Lau, Xie Ling, Liao Ebin, C.S. Premachandran, Kelvin Chen Wei Sheng, A. Khairyanto, Ong Siong Chiew, Bin Ratmin
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Low temperature bonding technology was developed using In-alloy on Au at a low temperature below 200 °C forming robust intermetallics (IMC) joints with high remelting temperature (≫300°C), so that after bonding, the IMC joints can withstand the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88e386b7bc8bf76f9a35ef90d3766fc0
https://doi.org/10.1109/ectc.2009.5074036
https://doi.org/10.1109/ectc.2009.5074036
Akademický článek
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Akademický článek
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Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p84-87, 4p
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p595-599, 5p
Autor:
Choi, Won Kyoung, Premachandran, C. S., Xie, Ling, Ong, Siong Chiew, He, Johnny Han, Yap, Guan Jie, Yu, Aibin
Publikováno v:
2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p829-833, 5p