Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Omer Vikinski"'
Autor:
Omer Vikinski, Alexander Waizman
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d07d33ab15098a148528372c3b739a94
https://doi.org/10.23919/icep58572.2023.10129688
https://doi.org/10.23919/icep58572.2023.10129688
Autor:
Omer Vikinski, Alexander Waizman
Publikováno v:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67e7541962e0f1a7132aa564e3773bad
https://doi.org/10.1109/emcsi39492.2022.10050227
https://doi.org/10.1109/emcsi39492.2022.10050227
Publikováno v:
A-SSCC
This paper describes the Second Generation Intel® Core™ processor, a 32nm monolithic die integrating four IA cores, a processor graphics and a memory controller. The die was designed for high performance but without compromising the part power con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86cdb1bf6b34f87121ee67cefa2f7768
https://doi.org/10.1109/asscc.2011.6123652
https://doi.org/10.1109/asscc.2011.6123652
Publikováno v:
ISOCC
This paper presents design and implementation of noise inducer devices mounted on the package of a full featured microprocessor. Such assembly enables vast sensitivity characterization capabilities of the chip circuits and systems to supply noises. P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a982bba223f8d4f684e14d0de1a36775
https://doi.org/10.1109/isocc.2011.6138615
https://doi.org/10.1109/isocc.2011.6138615
Autor:
Omer Vikinski
Publikováno v:
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.
High frequency supply noise affects chip performance in mechanisms that go beyond logic path failures due to voltage drops. One of the dominant chip performance degradation mechanisms due to high frequency noise is the direct introduction of clock ji
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24b4cf46ccfc1c6fea3519a57b18a96b
https://doi.org/10.1109/epeps.2011.6100186
https://doi.org/10.1109/epeps.2011.6100186
Autor:
Rami Ben-Ezra, Omer Vikinski
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Module daughter cards are conventional approach in electronic integrated system solutions. Applying same principals for CPU products was abandoned some generations ago, yet may still hold some potential for concurrent and future products. Board to bo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b140ff41037708d966b547f21a82ce3
https://doi.org/10.1109/ectc.2010.5490812
https://doi.org/10.1109/ectc.2010.5490812
Autor:
Omer Vikinski
Publikováno v:
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.
High resolution electrical models can be generated for chip packaging power delivery networks. The lumped versus distributed stitching of vertical path connections such as micro-via and plated-through-holes can introduce various effects on the model
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::056a29f52ee13fbfd671c3fabc58791d
https://doi.org/10.1109/epeps.2009.5338433
https://doi.org/10.1109/epeps.2009.5338433
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Noise injection into power supply rails during chip validation can offer insight for effective power delivery design and to assist product certification. There are no available commercial solutions that offer broadband stimuli application for such ai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d8b3b9b5f7282a77da88ea5ca18a957
https://doi.org/10.1109/ectc.2009.5074248
https://doi.org/10.1109/ectc.2009.5074248
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
Microprocessor architecture poses constraints over the dynamic load consumption. Those constraints limit the range of hypothetical stimuli that the power delivery scheme can experience. Some guiding rules for power delivery quality relaxation can be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::519caa5bb12e735acbe4328f8c621274
https://doi.org/10.1109/epep.2008.4675861
https://doi.org/10.1109/epep.2008.4675861
Publikováno v:
ITC
Growing gaps between testing and system environments is being observed for small form factor microprocessors. Power delivery high frequency resonances are significantly higher at test compared to actual system. Those gaps translate to poor yield for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f33aff6460335bf29b158daaeb7bb3b
https://doi.org/10.1109/test.2008.4700569
https://doi.org/10.1109/test.2008.4700569