Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Olsson RH 3rd"'
Autor:
Singh S; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Applied Physics and Science Education, Eindhoven University of Technology, Eindhoven 5600 MB, The Netherlands., Kim KH; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jo K; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Musavigharavi P; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32816, United States., Kim B; Department of Physics and Astronomy, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Zheng J; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Trainor N; Department of Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania 16801, United States., Chen C; 2D Crystal Consortium Materials Innovation Platform, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania 16801, United States., Redwing JM; Department of Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania 16801, United States.; 2D Crystal Consortium Materials Innovation Platform, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania 16801, United States., Stach EA; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
ACS nano [ACS Nano] 2024 Jul 09; Vol. 18 (27), pp. 17958-17968. Date of Electronic Publication: 2024 Jun 25.
Autor:
Xu J; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Zhao T; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Zaccarin AM; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Du X; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Yang S; Department of Chemistry, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Ning Y; Department of Chemistry, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Xiao Q; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Kramadhati S; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Choi YC; Department of Chemistry, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Murray CB; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Chemistry, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Kagan CR; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Chemistry, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
ACS nano [ACS Nano] 2024 Jul 09; Vol. 18 (27), pp. 17611-17621. Date of Electronic Publication: 2024 Jun 25.
Autor:
Kim KH; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Han Z; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Physics and Astronomy, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Zhang Y; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Musavigharavi P; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Zheng J; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Pradhan DK; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Stach EA; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
ACS nano [ACS Nano] 2024 Jun 18; Vol. 18 (24), pp. 15925-15934. Date of Electronic Publication: 2024 Jun 03.
Autor:
Du X; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Idjadi MH; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Ding Y; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Zhang T; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Geers AJ; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Yao S; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Pyo JB; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Aflatouni F; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Allen M; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA. rolsson@seas.upenn.edu.
Publikováno v:
Nature communications [Nat Commun] 2024 Apr 27; Vol. 15 (1), pp. 3582. Date of Electronic Publication: 2024 Apr 27.
Autor:
Mion T; US Naval Research Laboratory, American Society for Engineering Education Postdoc, Washington, DC 02375, USA., D'Agati MJ; Electrical and Systems Engineering Department, University of Pennsylvania, Philadelphia, PA 19104, USA., Sofronici S; Electrical and Systems Engineering Department, University of Pennsylvania, Philadelphia, PA 19104, USA., Bussmann K; US Naval Research Laboratory, Materials Science and Technology Division, Washington, DC 02375, USA., Staruch M; US Naval Research Laboratory, Materials Science and Technology Division, Washington, DC 02375, USA., Kost JL; US Naval Research Laboratory, Acoustics Division, Washington, DC 02375, USA., Co K; Laboratoire Structures, Propriétés et Modélisation des Solides, CentraleSupélec, Université Paris-Saclay, 91190 Gif-sur-Yvette, France., Olsson RH 3rd; Electrical and Systems Engineering Department, University of Pennsylvania, Philadelphia, PA 19104, USA., Finkel P; US Naval Research Laboratory, Materials Science and Technology Division, Washington, DC 02375, USA.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2023 Oct 21; Vol. 23 (20). Date of Electronic Publication: 2023 Oct 21.
Autor:
Kim KH; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Oh S; Division of Electrical Engineering, Hanyang University ERICA, Ansan, South Korea., Fiagbenu MMA; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Zheng J; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA., Musavigharavi P; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA.; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA., Kumar P; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Trainor N; Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, USA., Aljarb A; Department of Physics, King Abdulaziz University, Jeddah, Saudi Arabia., Wan Y; Department of Physical Science and Engineering, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia., Kim HM; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Katti K; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Song S; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Kim G; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Tang Z; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Fu JH; Department of Chemical System Engineering, University of Tokyo, Tokyo, Japan., Hakami M; Department of Chemical System Engineering, University of Tokyo, Tokyo, Japan., Tung V; Department of Physical Science and Engineering, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia.; Department of Chemical System Engineering, University of Tokyo, Tokyo, Japan., Redwing JM; Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, USA., Stach EA; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA, USA., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA. rolsson@seas.upenn.edu., Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA. dmj@seas.upenn.edu.
Publikováno v:
Nature nanotechnology [Nat Nanotechnol] 2023 Sep; Vol. 18 (9), pp. 1044-1050. Date of Electronic Publication: 2023 May 22.
Autor:
Kim KH; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Karpov I; Components Research, Intel Corporation, Hillsboro, OR, USA., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA., Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA. dmj@seas.upenn.edu.
Publikováno v:
Nature nanotechnology [Nat Nanotechnol] 2023 May; Vol. 18 (5), pp. 422-441. Date of Electronic Publication: 2023 Apr 27.
Autor:
Liu X; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Ting J; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., He Y; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Fiagbenu MMA; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Zheng J; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Wang D; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Frost J; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Musavigharavi P; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Esteves G; Microsystems Engineering, Science and Applications (MESA), Sandia National Laboratories, Albuquerque, New Mexico 87185, United States., Kisslinger K; Brookhaven National Laboratory, Center for Functional Nanomaterials, Upton, New York 11973, United States., Anantharaman SB; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Stach EA; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Laboratory for Research on the Structure of Matter, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Olsson RH 3rd; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jariwala D; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
Nano letters [Nano Lett] 2022 Sep 28; Vol. 22 (18), pp. 7690-7698. Date of Electronic Publication: 2022 Sep 19.
Autor:
Beaucejour R; Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, 220 S. 33rd St., Philadelphia, PA 19104, USA., D'Agati M; Department of Electrical and Systems Engineering, University of Pennsylvania, 3205 Walnut St., Philadelphia, PA 19104, USA., Kalyan K; Singh Center for Nanotechnology, University of Pennsylvania, 3205 Walnut St., Philadelphia, PA 19104, USA., Olsson RH 3rd; Department of Electrical and Systems Engineering, University of Pennsylvania, 3205 Walnut St., Philadelphia, PA 19104, USA.
Publikováno v:
Micromachines [Micromachines (Basel)] 2022 Jul 24; Vol. 13 (8). Date of Electronic Publication: 2022 Jul 24.
Autor:
Tang Z; Electrical and Systems Engineering Department, University of Pennsylvania, Philadelphia, PA 19104, USA., Esteves G; Microsystems Engineering, Science and Applications (MESA), Sandia National Laboratories, Albuquerque, NM 87123, USA., Zheng J; Material Science and Engineering Department, University of Pennsylvania, Philadelphia, PA 19104, USA., Olsson RH 3rd; Electrical and Systems Engineering Department, University of Pennsylvania, Philadelphia, PA 19104, USA.
Publikováno v:
Micromachines [Micromachines (Basel)] 2022 Jul 02; Vol. 13 (7). Date of Electronic Publication: 2022 Jul 02.