Zobrazeno 1 - 10
of 160
pro vyhledávání: '"Oliver Krammer"'
Publikováno v:
Materials, Vol 15, Iss 14, p 4734 (2022)
Stencil printing is the most crucial process in reflow soldering for the mass assembly of electronic circuits. This paper investigates different machine learning-based methods to predict the essential process characteristics of stencil printing: the
Externí odkaz:
https://doaj.org/article/25e8ba17769e4dadba044700dfb9123f
Autor:
Karel Dušek, Petr Veselý, David Bušek, Adam Petráč, Attila Géczy, Balázs Illés, Oliver Krammer
Publikováno v:
Materials, Vol 14, Iss 24, p 7909 (2021)
Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/
Externí odkaz:
https://doaj.org/article/563820af12054a5f89dfc5d8dd866fa1
Publikováno v:
Applied Sciences, Vol 11, Iss 10, p 4670 (2021)
The pin-in-paste technology is an advancing soldering technology for assembling complex electronic products, which include both surface-mounted and through-hole components. A computational fluid dynamics model was established to investigate the stenc
Externí odkaz:
https://doaj.org/article/bd5d9f1c722f491980b0d3fb92457428
Publikováno v:
Soldering & Surface Mount Technology, 2016, Vol. 28, Issue 1, pp. 13-17.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-10-2015-0029
Autor:
Péter Martinek, Oliver Krammer
Publikováno v:
Periodica Polytechnica Electrical Engineering and Computer Science. 66:132-138
Stencil printing is one of the key steps in reflow soldering technology, and by the spread of ultra-fine-pitch components, analysis of this process is essential. The process of stencil printing has been investigated by a machine learning technique ut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44e4fd35e29860f67d6a349898daaa75
https://doi.org/10.3311/ppee.19274
https://doi.org/10.3311/ppee.19274
Publikováno v:
Materials, Vol 13, Iss 22, p 5251 (2020)
Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated
Externí odkaz:
https://doaj.org/article/3c3d1690e88845ceb8cfde6f33ee92ce
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8bc2fe0cc36510cede484cfb1a47e63
https://doi.org/10.1109/estc55720.2022.9939556
https://doi.org/10.1109/estc55720.2022.9939556
Autor:
Attila Geczy, Andras Csiszar, Egon Rozs, Istvan Hajdu, Balint Medgyes, Oliver Krammer, Daniel Straubinger, Laszlo Gal
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12c83c8bf9afd939de2b23fdaefdc8d1
https://doi.org/10.1109/isse54558.2022.9812827
https://doi.org/10.1109/isse54558.2022.9812827
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:16314-16323
The kinetics of Sn whisker growth was investigated on vacuum-evaporated Sn thin-films. Sn film layers were deposited on a Cu substrate with 0.5 and 1 µm thicknesses. The samples were stored in room conditions (22 ± 1 °C/50 ± 5RH%) for 60 days. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed664548a756dde1db7e8b62032848f2
https://doi.org/10.1007/s10854-020-04180-2
https://doi.org/10.1007/s10854-020-04180-2
Publikováno v:
Soldering & Surface Mount Technology. 32:219-223
Purpose The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0011984853dbb8fd11100c022f303188
https://doi.org/10.1108/ssmt-11-2019-0037
https://doi.org/10.1108/ssmt-11-2019-0037