Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Oleg Golonzka"'
Autor:
Albert Chen, Ilya V. Karpov, Yifu Huang, Oleg Golonzka, Chris Connor, Nathan L. Strutt, Jiahan Zhang, Benjamin Sherrill, Tanmoy Pramanik, Jacob Medeiros, David Janosky, Jack C. Lee, Tony Acosta, Reed Hopkins, Abdullah Guler, Pedro A. Quintero, J. Hicks, Yao-Feng Chang, J. O'Donnell
Publikováno v:
IRPS
For the first time, the impact of temperature instability of resistive memory switching on potential neuromorphic computing applications has been extensively studied using eNVM-R and eNVM-M technologies developed on Intel 22FFL process. The reliabili
Autor:
Yao-Feng Chang, Oleg Golonzka, Roza Kotlyar, Nathan L. Strutt, Chris Connor, Albert Chen, J. Hicks, Tony Acosta, J. O'Donnell, Pedro A. Quintero
Publikováno v:
IRPS
For the first time, a comprehensive study of embedded nonvolatile memory (eNVM) resistive random access memory (RRAM) reliability performance and modeling in 22FFL FinFET technology is presented. RRAM retention relaxation is characterized and modeled
Autor:
Umut Arslan, Philip E. Heil, Smith Angeline K, Pedro A. Quintero, Ouellette Daniel G, Juan G. Alzate, Sell Bernhard, Smith Andrew, Fatih Hamzaoglu, M. Seth, Pellegren James, M. Mainuddin, Tahir Ghani, Y. J. Chen, P. Bai, Rownak Jahan, Tanmoy Pramanik, Tofizur Rahman, Liqiong Wei, Justin S. Brockman, Conor P. Puls, P. Hentges, M. Sekhar, Aaron J. Littlejohn, Kevin J. Fischer, Oleg Golonzka, Christopher J. Wiegand, Nilanjan Das
Publikováno v:
2019 IEEE International Electron Devices Meeting (IEDM).
In this paper, we discuss array-level MTJ process, performance, and reliability requirements for STT-MRAM operation in an L4 Cache application. We demonstrate 2 MB arrays of scaled-size MTJ devices capable of meeting L4 Cache specifications across al
Autor:
Fatih Hamzaoglu, C. English, Tahir Ghani, Matthew V. Metz, Joodong Park, Pedro A. Quintero, M. Seth, M. Sekhar, Kevin J. Fischer, Seghete Dragos, Ilya V. Karpov, Christopher J. Jezewski, Yao-Feng Chang, P. Bai, Nilanjan Das, Ouellette Daniel G, J. O'Donnell, A. Pirkle, M. Bohr, Pulkit Jain, Umut Arslan, James S. Clarke, A. Sen Gupta, A. Chaudhari, Albert Chen, Blake C. Lin, O. Baykan, Oleg Golonzka, Christopher J. Wiegand, Chris Connor, Roza Kotlyar, Hui Jae Yoo, Nathan L. Strutt, P. Hentges, H. Kothari
Publikováno v:
2019 Symposium on VLSI Technology.
This paper presents key specifications of RRAM-based nonvolatile memory embedded into Intel 22FFL FinFET Technology. 22FFL is a high performance, ultra low power technology developed for mobile and RF applications providing extensive high voltage and
Autor:
Fatih Hamzaoglu, Justin S. Brockman, Kevin J. Fischer, Tanmoy Pramanik, Oleg Golonzka, J. Hicks, Chris Connor, Juan G. Alzate, J. O'Donnell
Publikováno v:
IRPS
Assessing product-level retention performance of a perpendicular spin-transfer torque magnetic random access memory (STT-MRAM, or MRAM for short) for non-volatile applications requires extrapolation of retention data measured on a relatively small nu
Autor:
Liqiong Wei, Mesut Meterelliyoz, Oleg Golonzka, Pedro A. Quintero, M. Sekhar, Kevin J. Fischer, Ajay Vangapaty, Pulkit Jain, Tanaya Sahu, Blake C. Lin, Chris Connor, P. Hentges, Nathan L. Strutt, Albert Chen, Fatih Hamzaoglu, Umut Arslan, Alzate-Vinasco Juan G
Publikováno v:
ISSCC
A resistive RAM (ReRAM) macro is developed as a low-cost, magnetic-disturb-immune option for embedded, non-volatile memory for SoCs used in IoT and automotive applications. We demonstrate the smallest ReRAM subarray density of 10.1Mb/mm2 in a 22nm lo
Autor:
Jim OrDonnell, Fatih Hamzaoglu, Tahir Ghani, Kevin J. Fischer, Justin S. Brockman, Oleg Golonzka, Christopher J. Wiegand, Liqiong Wei, Nilanjan Das, Umut Arslan, Pulkit Jain, Blake C. Lin, Juan G. Alzate, Tanaya Sahu, Pedro A. Quintero, Mesut Meterelliyoz, P. Hentges, M. Sekhar, Ajay Vangapaty, Conor P. Puls, Rawshan Jahan
Publikováno v:
ISSCC
STT-MRAM has been emerging as a very-promising high-density embedded non-volatile memory (eNVM) [1], [2]. Embedded Flash memory has been the leading eNVM technology, but STT-MRAM has been developed as a better solution for continuing scaling, speed a
Autor:
Mesut Meterelliyoz, Tahir Ghani, Kevin J. Fischer, O'brien Kevin P, Pellegren James, Dmitri E. Nikonov, J.O Donnell, Chris Connor, Nilanjan Das, P. Nguyen, Smith Andrew, Buford Benjamin, Pedro A. Quintero, P. Hentges, Justin S. Brockman, M. Seth, M. Mainuddin, Philip E. Heil, Smith Angeline K, Brian S. Doyle, Rownak Jahan, Z. Zhang, David L. Kencke, M. Bohr, Liqiong Wei, P. Bai, Tofizur Rahman, M. Lu, Blake C. Lin, M. Sekhar, Conor P. Puls, Kaan Oguz, Joodong Park, A. Selarka, A. Romang, Oleg Golonzka, Christopher J. Wiegand, Juan G. Alzate, Ouellette Daniel G, Umut Arslan, Fatih Hamzaoglu
Publikováno v:
2018 IEEE International Electron Devices Meeting (IEDM).
This paper presents key features of MRAM-based non-volatile memory embedded into Intel 22FFL technology. 22FFL is a high performance, ultra low power FinFET technology for mobile and RF applications with extensive high voltage and analog support, and
Publikováno v:
The Journal of Chemical Physics. 117:7102-7116
Hyperfine patterns calculations are carried out for the Na3 cluster with a view towards understanding the microwave measurements which were performed for three rotational transitions belonging to the ground X electronic state. The calculations take s
Publikováno v:
Journal of Molecular Spectroscopy. 184:237-249
$^{1}$ W.E. Ernst and S. Rakowsky, Phys. Rev. Lett. 74, 58 (1995). $^{2}$ W.E. Ernst and S. Rakowsky, Ber. Bunsenges. Phys. Chem. 99, 441 (1995). $^{3}$ H.-A. Eckel, J.M. Gress, J. Biele, and W. Demtr\""{o}der, J. Chem, Phys. 98, 135 (1993). $^{4}$ M