Zobrazeno 1 - 10
of 70
pro vyhledávání: '"Olaf Wittler"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d75468f597cf8b3d915b87b92019d4ea
https://doi.org/10.1109/eurosime56861.2023.10100794
https://doi.org/10.1109/eurosime56861.2023.10100794
Autor:
Andreas Stegmaier, Ole Hölck, Marius van Dijk, Hans Walter, Olaf Wittler, Martin Schneider-Ramelow
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73b86c139146a6280726164909c91dc7
https://doi.org/10.1109/eurosime56861.2023.10100849
https://doi.org/10.1109/eurosime56861.2023.10100849
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eae81e4f7ea6838b8e4790faf58057e
https://doi.org/10.1109/eurosime56861.2023.10100845
https://doi.org/10.1109/eurosime56861.2023.10100845
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76c0f24035c067352dba2e449431a8c0
https://doi.org/10.1109/eurosime56861.2023.10100825
https://doi.org/10.1109/eurosime56861.2023.10100825
Autor:
Piotr Mackowiak, Olaf Wittler, Tanja Braun, Kolia Erbacher, Michael Schiffer, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4f09327e4a0034f70271a32e666bc1b
https://doi.org/10.1109/eptc56328.2022.10013212
https://doi.org/10.1109/eptc56328.2022.10013212
Autor:
Piotr Mackowiak, Olaf Wittler, Tanja Braun, Janine Conrad, Michael Schiffer, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30405ad6d017b4b8b1c7492627662356
https://doi.org/10.1109/estc55720.2022.9939379
https://doi.org/10.1109/estc55720.2022.9939379
Autor:
Marius van Dijk, Olaf Wittler, Ping-Chi Hung, Wei-Hong Lai, Cheng-Yu Hsieh, Thomas Wang, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd489226b60180902a31ea6aae4a43bd
https://doi.org/10.1109/ectc51906.2022.00279
https://doi.org/10.1109/ectc51906.2022.00279
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc0fbf176654f05c647eb4a2d89cf49b
https://doi.org/10.1109/eurosime54907.2022.9758865
https://doi.org/10.1109/eurosime54907.2022.9758865
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a69f7fa7fa9fbf523c1bfeca27251795
https://doi.org/10.1109/eurosime54907.2022.9758846
https://doi.org/10.1109/eurosime54907.2022.9758846
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:974-981
Thermomechanical modeling of a new double-overmolded optical sensor package, comprising a highly filled, as well as an unfilled, strongly thermally expanding transfer molding compound, is presented. Materials' characterization of the polymers using t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3856909e9fce8c1e8c8ef0f4617af28e
https://doi.org/10.1109/tcpmt.2020.2986714
https://doi.org/10.1109/tcpmt.2020.2986714