Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Oktay YILDIRIM"'
Autor:
Oktay YILDIRIM, Özlem AKTAŞ, Ali Rıza ŞİŞMAN, Dilek ORBATU, Senem ALKAN ÖZDEMİR, Adem AYDIN, Eminullah YAŞAR, Mohammed Abebe YİMER, Süleyman SEVİNÇ
Publikováno v:
Forbes Tıp Dergisi, Vol 4, Iss 1, Pp 95-102 (2023)
Objective: Due to the difficulties in determining reference intervals with conventional methods, it determines them using modern machine learning methods. Methods: The results of the newborns' inorganic phosphorus, calcium, creatinine, neonatal bilir
Externí odkaz:
https://doaj.org/article/98616152a707410ea73467c1548fce4b
Publikováno v:
Frontiers in Pharmacology, Vol 7 (2016)
Drug development faces the double challenge of increasing costs and increasing pressure on pricing. To avoid that lack of perceived commercial perspective will leave existing medical needs unmet, pharmaceutical companies and many other stakeholders a
Externí odkaz:
https://doaj.org/article/5d2de98168f8441e8d7e545493ad08fb
Autor:
Guus Rijnders, Jurriaan Huskens, Wilfred G. van der Wiel, Dave H. A. Blank, David N. Reinhoudt, Sachin Kinge, Tian Gang, Oktay Yildirim
Publikováno v:
International Journal of Molecular Sciences, Vol 11, Iss 3, Pp 1162-1179 (2010)
FePt nanoparticles (NPs) were assembled on aluminum oxide substrates, and their ferromagnetic properties were studied before and after thermal annealing. For the first time, phosph(on)ates were used as an adsorbate to form self-assembled monolayers (
Externí odkaz:
https://doaj.org/article/3f2a2eab82e4464a81875f8c730b6430
Autor:
Suleyman Sevinc, Ali Riza Sisman, Banu İşbilen Başok, Murat Aksit, Pinar Bilgi, Oktay Yildirim, Eminullah Yasar, Ayfer Colak, Can Duman, Gokhan Akbulut
Publikováno v:
Journal of Artificial Intelligence in Health Sciences. 2:19-26
İç Kalite Kontrol (İKK), hasta numunelerini çalıştırmadan önce bir laboratuvar testinin güvenilirliğini değerlendirme ve kontrol etme sürecidir. Mevcut İKK süreci, kural tabanlı yaklaşımlar kullanarak Toplam Analitik Hatanın (TAE) y
Autor:
Richard J. F. van Haren, Oktay Yildirim, Orion Mouraille, Leon van Dijk, Kaushik Kumar, Yannick Feurprier, Christiane Jehoul, Jan Hermans
Publikováno v:
Advanced Etch Technology and Process Integration for Nanopatterning XI.
Autor:
Leon van Dijk, Yannick Feurprier, Richard Johannes Franciscus Van Haren, Oktay Yildirim, Orion Mouraille, Kaushik A. Kumar, Jan Hermans
Publikováno v:
Advanced Etch Technology and Process Integration for Nanopatterning X.
Recently, the etch induced on-product overlay contribution as part of the total on-product overlay budget has received more attention. The main reason for this is that the etch induced overlay penalties are comparable to or even exceeding the state-o
Autor:
Yannick Feurprier, Richard Johannes Franciscus Van Haren, Jan Hermans, Orion Mouraille, Kaushik A. Kumar, Leon van Dijk, Oktay Yildirim
Publikováno v:
Advanced Etch Technology for Nanopatterning IX.
The etch induced on-product overlay performance across wafer has received quite some attention recently. Global wafer overlay penalties have been observed by realizing that the etch direction is not always perpendicular to the wafer surface and may v
Publikováno v:
2019 Innovations in Intelligent Systems and Applications Conference (ASYU).
The Internet of Things refers to any object or device that automatically sends and receives data over the Internet. This rapidly expanding concept is now being used as "the Internet of Everything". This structure includes sensors and devices that int
Autor:
Tomoki Nagai, Satoshi Dei, Akihiro Oshima, Gijsbert Rispens, Yasin Ekinci, Marieke Meeuwissen, Hisashi Nakagawa, Seiichi Tagawa, Seiji Nagahara, Yuichi Terashita, Kosuke Yoshihara, Yukie Minekawa, Takehiko Naruoka, Oktay Yildirim, Coen Verspaget, Raymond Maas, Elizabeth Buitrago, Gosuke Shiraishi, Rik Hoefnagels
Publikováno v:
Journal of Photopolymer Science and Technology. 29:475-478
Autor:
Karen Garrido Olvera, Marieke Meeuwissen, Rik Hoefnagels, Zuhal Tasdemir, Yasin Ekinci, Iacopo Mochi, Oktay Yildirim, Rolf Custers, Gijsbert Rispens, Michaela Vockenhuber
Publikováno v:
Extreme Ultraviolet (EUV) Lithography IX
As EUV lithography moves toward high-volume manufacturing phase, one of the key factors determining the throughput and yield is the resist performance, i.e. resolution, sensitivity, and line-edge roughness. At Paul Scherrer Institute (PSI), we extens