Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ogase Taichi"'
Autor:
Eric M. Gullikson, Ogase Taichi, Seh-Jin Park, Hiroyoshi Tanabe, Tetsunori Murachi, Tsukasa Abe, Naoya Hayashi
Publikováno v:
SPIE Proceedings.
The measurement and extraction method of phase-shift values for thin and thick absorber Extreme Ultra-Violet (EUV) masks has been studied by both of experiments and simulations. We fabricated 4 EUV masks with different absorber thicknesses. We first
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9562571418b6accfc4993f0421f304f
https://doi.org/10.1117/12.976817
https://doi.org/10.1117/12.976817
Autor:
Seh-Jin Park, Guojing Zhang, Ogase Taichi, Manish Chandhok, Sang H. Lee, Naoya Hayashi, Hiroyoshi Tanabe, Tsukasa Abe, Tetsunori Murachi
Publikováno v:
SPIE Proceedings.
Phase-shifting effect of EUV masks with various absorber thicknesses has been studied both by simulations and experiments. In EUV lithography, masks with 180 phase shifting absorber work like embedded attenuated phase-shifting masks. At 66nm thicknes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d824dbd14b4a6f5658f59a3eb81984e
https://doi.org/10.1117/12.895149
https://doi.org/10.1117/12.895149
Autor:
Hiroshi Mohri, Naoya Hayashi, Kawashima Satoshi, Yuichi Inazuki, Ogase Taichi, Takeya Shimomura, Tadahiko Takigawa, Tsukasa Abe
Publikováno v:
SPIE Proceedings.
Achieving the specifications of resolution, sensitivity and line width roughness (LWR) of wafer resist is one of the top challenges of bringing extreme ultraviolet lithography (EUVL) into high volume manufacturing. Contributions to the resist LWR on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a44d34824792783e0de8f5758de6ce70
https://doi.org/10.1117/12.869592
https://doi.org/10.1117/12.869592
Autor:
Tanabe, Hiroyoshi, Murachi, Tetsunori, Lee, Sang H., Chandhok, Manish, Park, Seh-Jin, Zhang, Guojing, Abe, Tsukasa, Ogase, Taichi, Hayashi, Naoya
Publikováno v:
Proceedings of SPIE; October 2011, Vol. 8166 Issue: 1 p816618-816618-9