Fabrication of quantum point contacts by engraving GaAs/AlGaAs-heterostructures with a diamond tip

Autor: Regul, J., Keyser, U. F., Paesler, M., Hohls, F., Zeitler, U., Haug, R. J., Malave, A., Oesterschulze, E., Reuter, D., Wieck, A. D.

Publikováno v: Applied Physics Letters 81(11), 2023-2025 (2002)

We use the all-diamond tip of an atomic force microscope for the direct engraving of high quality quantum point contacts in GaAs/AlGaAs-heterostructures. The processing time is shortened by two orders of magnitude compared to standard silicon tips. T

Externí odkaz: http://arxiv.org/abs/cond-mat/0202402

Drainage during Condensation on Microgrooved Biphilic Surfaces.

Autor: Fotachov D; Department of Physics, Physics and Technology of Nanostructures, Rhineland-Palatinate Technical University of Kaiserslautern-Landau, Kaiserslautern 67663, Germany., Raab R; Fluidverfahrenstechnik, Rhineland-Palatinate Technical University of Kaiserslautern-Landau, Kaiserslautern 67663, Germany., Bart HJ; Fluidverfahrenstechnik, Rhineland-Palatinate Technical University of Kaiserslautern-Landau, Kaiserslautern 67663, Germany., Oesterschulze E; Department of Physics, Physics and Technology of Nanostructures, Rhineland-Palatinate Technical University of Kaiserslautern-Landau, Kaiserslautern 67663, Germany.

Publikováno v: Langmuir : the ACS journal of surfaces and colloids [Langmuir] 2024 Jan 16; Vol. 40 (2), pp. 1195-1202. Date of Electronic Publication: 2023 Dec 29.

A method to investigate the temporal spectral response of microresonators affected by optical read-out techniques

Autor: Radzio, B., Kehrbusch, J., Ilin, E.A., Oesterschulze, E.

Publikováno v: In Microelectronic Engineering August 2011 88(8):2352-2354

Columnar shaped microresonators for mass detection and gas analysis

Autor: Kehrbusch, J., Bozek, P., Radzio, B., Ilin, E.A., Oesterschulze, E.

Publikováno v: In Microelectronic Engineering 2010 87(5):817-820

Fabrication and characterization of coaxial scanning near-field optical microscopy cantilever sensors

Autor: Salomo, M., Bayer, D., Schaaf, B.R., Aeschlimann, M., Oesterschulze, E.

Publikováno v: In Microelectronic Engineering 2010 87(5):1540-1542