Phenotypic Diversity within Ugandan Yam (Dioscorea species) Germplasm Collection.

Autor: Adjei, Emmanuel Amponsah, Esuma, Williams, Alicai, Titus, Bhattacharjee, Ranjana, Dramadri, Isaac Onziga, Agaba, Rolland, Chamba, Emmanuel Boache, Odong, Thomas L.

Publikováno v: International Journal of Agronomy; 12/19/2022, p1-10, 10p

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.

Genotype by environment effects on promiscuous nodulation in soybean (Glycine max L. Merrill).

Autor: Agoyi, Eric E., Odong, Thomas L., Tumuhairwe, John B., Chigeza, Godfree, Diers, Brian W., Tukamuhabwa, Phinehas

Publikováno v: Agriculture & Food Security; 3/17/2017, Vol. 6, p1-14, 14p

Using cross-country datasets for association mapping in Arachis hypogaea L.

Autor: Okaron V; Department of Agricultural Production, School of Agricultural Sciences, College of Agricultural and Environmental Sciences, Makerere University, Kampala, Uganda., Mwololo J; International Crops Research Institute for the Semi-Arid Tropics (ICRISAT), Bulawayo, Zimbabwe., Gimode DM; International Crops Research Institute for the Semi-Arid Tropics- Kenya, Nairobi, Kenya., Okello DK; National Semi-Arid Resources Research Institute, Soroti, Uganda., Avosa M; International Crops Research Institute for the Semi-Arid Tropics- Kenya, Nairobi, Kenya., Clevenger J; HudsonAlpha Institute for Biotechnology, Huntsville, Alabama, USA., Korani W; HudsonAlpha Institute for Biotechnology, Huntsville, Alabama, USA., Ssemakula MO; Department of Agricultural Production, School of Agricultural Sciences, College of Agricultural and Environmental Sciences, Makerere University, Kampala, Uganda., Odong TL; Department of Agricultural Production, School of Agricultural Sciences, College of Agricultural and Environmental Sciences, Makerere University, Kampala, Uganda., Odeny DA; International Crops Research Institute for the Semi-Arid Tropics- Kenya, Nairobi, Kenya.

Publikováno v: The plant genome [Plant Genome] 2024 Oct 15, pp. e20515. Date of Electronic Publication: 2024 Oct 15.