Zobrazeno 1 - 10
of 85
pro vyhledávání: '"Ockgoo Lee"'
Publikováno v:
Nanomaterials, Vol 14, Iss 3, p 262 (2024)
The narrowband Internet-of-Things (NB-IoT) has been developed to provide low-power, wide-area IoT applications. The efficiency of a power amplifier (PA) in a transmitter is crucial for a longer battery lifetime, satisfying the requirements for output
Externí odkaz:
https://doaj.org/article/59b329f9597848389fb52127aba19c1a
Publikováno v:
IEEE Access, Vol 10, Pp 57003-57011 (2022)
A CMOS up-conversion mixer with an intermediate frequency (IF) amplifier and local oscillator (LO) buffer is presented for mobile 28-GHz-band 5G dual-conversion transceivers. A balun transformer with improved common-mode rejection ratio characteristi
Externí odkaz:
https://doaj.org/article/16c4bc9a871b4cdfa54d1c4b8a94565e
Publikováno v:
IEEE Access, Vol 9, Pp 85060-85070 (2021)
This paper presents a highly efficient InGaP/GaAs HBT power amplifier (PA) implemented using a proposed high- $Q$ single- and two-winding transformer. A single- and two-winding transformer is designed with a printed circuit board (PCB) to combine the
Externí odkaz:
https://doaj.org/article/6d75dc04fd4d48ab9bc05236e88f1cb1
Publikováno v:
IEEE Access, Vol 9, Pp 150304-150321 (2021)
This paper presents a fully integrated linear power amplifier (PA) in a 65-nm CMOS process for mm-wave 5G applications. The proposed linear PA employs a compact symmetrical 4-way parallel–parallel power combiner with a third-order intermodulation d
Externí odkaz:
https://doaj.org/article/4ce3024ac42c40ab8b85aa4313550afa
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 23:128-137
Publikováno v:
The Journal of Korean Institute of Electromagnetic Engineering and Science. 33:911-918
Publikováno v:
The Journal of Korean Institute of Electromagnetic Engineering and Science. 33:829-840
Autor:
Seungjik Lee, Ockgoo Lee, Jinman Myung, Geonwoo Park, Yangji Jeon, Suyeon Lee, Hyunwon Moon, Ilku Nam
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 21:279-285
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 21:263-269
Publikováno v:
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC).