Zobrazeno 1 - 1
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pro vyhledávání: '"O. W. Bungum"'
Publikováno v:
Microelectronics International. 13:16-19
This paper describes the processing and electrical characterisation of an interconnection substrate technology called Combifilm. The study focuses on digital applications. According to calculations, the conductivity of the reference plane is shown no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::879da8c26ca51d334afaad3e3c78f11f
https://doi.org/10.1108/13565369610800179
https://doi.org/10.1108/13565369610800179
