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pro vyhledávání: '"O. P. L. Wilson"'
Autor:
K. Y. S. Drake, Tan Hua Hong, J. Beleran, O. P. L. Wilson, X. R. Zhang, G. Librado, G. Mehta, C. Surasit
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:1923-1933
There is a rapid transition in the semiconductor packaging industry of devices moving toward 40/45-nm extreme low k (ELK) from the development phase into mainstream semiconductor assembly manufacturing. The drive to achieve adoption without major cha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a946617c8947f1e9c60560f5c11fa2f2
https://doi.org/10.1109/tcpmt.2011.2158106
https://doi.org/10.1109/tcpmt.2011.2158106
