Zobrazeno 1 - 10
of 64
pro vyhledávání: '"O. Holck"'
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In the past years, epoxy resin molding compounds (EMCs) have gained in importance as packaging material in the field of electrification due to their very good mechanical and chemical resistance and electrical insulation properties. Forthcoming trends
Autor:
Jean Trewhella, Thi Huyen Le, Karl-Friedrich Becker, Daniel Berger, Mathias Bottcher, Tanja Braun, O. Holck, Michael Schiffer, Ivan Ndip, Marcel Wieland, Martin Schneider-Ramelow, Marco Rossi, Friedrich Muller, Marcus Voitel, Rolf Aschenbrenner, Christian Goetze
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In the last years, the increasing demand for ever higher data rates in wireless communication has exposed the limits of current sub-6 GHz communication systems and pushed the technology towards the exploration of the mmWave frequency spectrum. In par
Autor:
Tanja Braun, Steve Voges, K.-F. Becker, Martin Schneider-Ramelow, R. Kahle, K-D. Lang, O. Holck, Marc Dreissigacker, J. Bauer, Rolf Aschenbrenner
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Within the European funded project smart-MEMPHIS the goal was to tackle the main challenge for all smart devices – self-powering. The project was aimed to design, manufacture and test a miniaturized autonomous energy supply based on harvesting vibr
Autor:
Tanja Braun, Hans Walter, M. Huhn, Matthias Wietstruck, Andreas Mai, Mehmet Kaynak, K-D. Lang, O. Holck, S. Raatz, K.-F. Becker, U. Maass, Michael Topper, R. F. Scholz, S. Voges, M. van Dijk, Markus Wohrmann, Rolf Aschenbrenner
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are the subst
Autor:
Bernhard Wunderle, Jörg Bauer, Klaus-Dieter Lang, O. Holck, Hans Walter, Tanja Braun, Olaf Wittler
Publikováno v:
Microelectronics Reliability. 53:1111-1116
In this work, the transport of water molecules at the interface of an epoxy molding compound to a SiO2 (chip surface) is investigated by molecular modelling. Experi-mental results of bulk diffusion of H2O into a DGGOA/DAIIBA epoxy/hardener system at
Autor:
O. Holck, Tanja Braun, Tom Dobs, Marcus Schulz, Stephan Benecke, Ingolf Schlosser, Olaf Wittler, V. Bader, Francisco Vergara, J. Keller, Klaus-Dieter Lang, Marius van Dijk, Talat Yacoub, Paul Bittner
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
Piezoelectric energy harvesters enable the energy supply for autonomous operating sensor systems environments with vibration. Models are needed for a suitable system design. On the one hand in order to ensure the functionality of such a system, the r
Publikováno v:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this work we present our results of an approach to assess material property changes with time due to high temperature ageing in an isotropic conductive adhesive. A molecular model of an epoxy with similar primary chemistry is investigated by molec
Publikováno v:
Microelectronics Reliability. 52:1285-1290
An investigation of interfacial interaction has been performed between three epoxy molding compound materials and a native silicon dioxide layer (SiO 2 ) usually found at chip surfaces. The epoxy materials were an industry oriented epoxy molding comp
Autor:
O. Holck, Bernhard Wunderle
Publikováno v:
Molecular Modeling and Multiscaling Issues for Electronic Material Applications ISBN: 9783319128610
The investigation of the mechanisms of delamination or fracture between the interfaces of different materials is a challenging yet necessary task in microelectronic packaging. A lot of the failure modes that are detected in highly integrated System i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::617bfe764b34add0d409d24026e05ad3
https://doi.org/10.1007/978-3-319-12862-7_4
https://doi.org/10.1007/978-3-319-12862-7_4
Autor:
Peggy John, Mathias Bottcher, K-D. Lang, Olaf Wittler, M. J. Wolf, Arian Grams, Conny Fiedler, Hans Walter, M. Nuss, O. Holck, T. Prewitz
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper we report experimental results of through silicon vias (TSVs) at an early processing step which are used in a context of reliability assessment. Parameter studies and evaluation of stresses using finite element analysis contribute to an