Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Nyein HYY"'
Autor:
Cao Y; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Lin H; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Lu X; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Wu X; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Zhu Y; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Zhao Z; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Li Y; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Borje S; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China., Lui GCY; Department of Medicine & Therapeutics, The Chinese University of Hong Kong, Shatin, Hong Kong Special Administrative Region of China., Lee SS; S.H. Ho Research Centre for Infectious Diseases, The Chinese University of Hong Kong, Shatin, Hong Kong Special Administrative Region of China., Nyein HYY; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China. Electronic address: hnyein@ust.hk., Hsing IM; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong Special Administrative Region of China. Electronic address: kehsing@ust.hk.
Publikováno v:
Biosensors & bioelectronics [Biosens Bioelectron] 2025 Jan 01; Vol. 267, pp. 116866. Date of Electronic Publication: 2024 Oct 22.
Autor:
Wang C; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, China., Guo Y; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, China., Han G; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, China., Zhou Y; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, China., Nyein HYY; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, China. Electronic address: hnyein@ust.hk.
Publikováno v:
Biosensors & bioelectronics [Biosens Bioelectron] 2025 Jan 01; Vol. 267, pp. 116769. Date of Electronic Publication: 2024 Sep 08.
Autor:
Li Y; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Hong Kong SAR, 00000, China., Veronica A; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Hong Kong SAR, 00000, China., Ma J; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Hong Kong SAR, 00000, China., Nyein HYY; Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Hong Kong SAR, 00000, China.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Aug 13, pp. e2408456. Date of Electronic Publication: 2024 Aug 13.
Autor:
Xu C; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA.; These authors contributed equally to this work., Song Y; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA.; These authors contributed equally to this work., Sempionatto JR; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA.; These authors contributed equally to this work., Solomon SA; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA.; These authors contributed equally to this work., Yu Y; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA., Nyein HYY; Department of Chemical and Biological Engineering, Hong Kong University of Science and Technology, Hong Kong, China., Tay RY; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA., Li J; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA., Heng W; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA., Min J; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA., Lao A; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA., Hsiai TK; Division of Cardiology, David Geffen School of Medicine, University of California, Los Angeles, CA, USA., Sumner JA; Department of Psychology, University of California, Los Angeles, CA, USA., Gao W; Andrew and Peggy Cherng Department of Medical Engineering, Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, USA.
Publikováno v:
Nature electronics [Nat Electron] 2024 Feb; Vol. 7 (2), pp. 168-179. Date of Electronic Publication: 2024 Jan 19.
Autor:
Nyein HYY; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Bariya M; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Tran B; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Ahn CH; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA., Brown BJ; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA., Ji W; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Davis N; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA., Javey A; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA. ajavey@berkeley.edu.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA. ajavey@berkeley.edu.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA. ajavey@berkeley.edu.
Publikováno v:
Nature communications [Nat Commun] 2021 Mar 23; Vol. 12 (1), pp. 1823. Date of Electronic Publication: 2021 Mar 23.
Autor:
Zhao J; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA., Nyein HYY; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA., Hou L; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA., Lin Y; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.; Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China., Bariya M; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA., Ahn CH; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA., Ji W; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA., Fan Z; Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China., Javey A; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2021 Jan; Vol. 33 (1), pp. e2006444. Date of Electronic Publication: 2020 Nov 23.
Autor:
Bariya M; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA., Li L; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA., Ghattamaneni R; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA., Ahn CH; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA., Nyein HYY; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA., Tai LC; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA., Javey A; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA.
Publikováno v:
Science advances [Sci Adv] 2020 Aug 28; Vol. 6 (35), pp. eabb8308. Date of Electronic Publication: 2020 Aug 28 (Print Publication: 2020).
Autor:
Tai LC; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Berkeley Sensor and Actuator Center, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Ahn CH; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States., Nyein HYY; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Berkeley Sensor and Actuator Center, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Ji W; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Berkeley Sensor and Actuator Center, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Bariya M; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Berkeley Sensor and Actuator Center, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Lin Y; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Berkeley Sensor and Actuator Center, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Li L; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States., Javey A; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.; Berkeley Sensor and Actuator Center, University of California, Berkeley, California 94720, United States.; Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States.
Publikováno v:
ACS sensors [ACS Sens] 2020 Jun 26; Vol. 5 (6), pp. 1831-1837. Date of Electronic Publication: 2020 May 28.
Autor:
Yu Y; Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, 91125, USA., Nyein HYY; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA., Gao W; Division of Engineering and Applied Science, California Institute of Technology, Pasadena, CA, 91125, USA., Javey A; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, 94720, USA.; Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, 94720, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2020 Apr; Vol. 32 (15), pp. e1902083. Date of Electronic Publication: 2019 Aug 20.
Autor:
Zhao C; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA.; Department of Materials Science and Engineering, University of California at Berkeley, Berkeley, CA, USA., Tan C; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Lien DH; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Song X; Department of Materials Science and Engineering, University of California at Berkeley, Berkeley, CA, USA.; The Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Amani M; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Hettick M; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Nyein HYY; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA.; Department of Materials Science and Engineering, University of California at Berkeley, Berkeley, CA, USA., Yuan Z; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Li L; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Scott MC; Department of Materials Science and Engineering, University of California at Berkeley, Berkeley, CA, USA.; The Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA., Javey A; Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA. ajavey@eecs.berkeley.edu.; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA. ajavey@eecs.berkeley.edu.
Publikováno v:
Nature nanotechnology [Nat Nanotechnol] 2020 Jan; Vol. 15 (1), pp. 53-58. Date of Electronic Publication: 2019 Dec 16.