Výsledky vyhledávání - "Nur Ain Athirah Amran"

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

Autor: Nur Ain Athirah Amran, Rita Mohd Said, Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh

Publikováno v: Solid State Phenomena. 280:206-211

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6603af0f18e3b658c380de3f9ba4ac2a
https://doi.org/10.4028/www.scientific.net/ssp.280.206

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