Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Nupur Bajad"'
Publikováno v:
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
A design of experiment (DOE) analysis is reported on data from warpage simulations using finite element analysis (FEA) of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05056b0dabcb11b9151805a4bf44e0e6
https://doi.org/10.23919/panpacific48324.2020.9059437
https://doi.org/10.23919/panpacific48324.2020.9059437
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79689ba1e9d4fd6f89ac0b6db8e7cfaa
https://doi.org/10.1109/itherm.2014.6892409
https://doi.org/10.1109/itherm.2014.6892409