Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Nunzio Mirabella"'
Autor:
Nunzio Mirabella, Michelangelo Grosso, Giovanna Franchino, Salvatore Rinaudo, Ioannis Deretzis, Antonino La Magna, Matteo Sonza Reorda
Publikováno v:
Electronics; Volume 11; Issue 2; Pages: 203
Electronics, Vol 11, Iss 203, p 203 (2022)
Electronics, Vol 11, Iss 203, p 203 (2022)
This paper compares different types of resistive defects that may occur inside low-power SRAM cells, focusing on their impact on device operation. Notwithstanding the continuous evolution of SRAM device integration, manufacturing processes continue t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::db8b660a7083af33a7d5468fa73b375a
In integrated circuit designs, the conductive connections between different layers are known as vias or cuts. Such structures are critical for digital circuit manufacturing, as they represent a common defect location. A well-established DfM/DfR rule
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::461dfd32d5f40665942e69aca5657f53
http://hdl.handle.net/11583/2920412
http://hdl.handle.net/11583/2920412
Publikováno v:
DDECS
Vias are critical for digital circuit manufacturing, as they represent a common defect location, and a general DfM rule suggests replicating every instance for redundancy. When this is not achievable, a mandatory requirement is that the remaining sin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0ede157828f831eb525625bb99e1f9d9
http://hdl.handle.net/11583/2920374
http://hdl.handle.net/11583/2920374