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Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Growth in the usage of heterogenous integration and chiplets-based designs in modern advanced packages for leading applications like AI and HPC is driving the need for very large chip sizes that exceed the dimensions of a single back-end stepper expo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::927770d465b8e1aa8940c8758c6aedd6
https://doi.org/10.1109/ectc32696.2021.00321
https://doi.org/10.1109/ectc32696.2021.00321
