Zobrazeno 1 - 10
of 482
pro vyhledávání: '"Noriyuki MIYAZAKI"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 845, Pp 16-00382-16-00382 (2016)
We proposed a new technique to analyze the asymptotic solution around a three dimensional interface corners. We analyzed the scalar parameters of the asymptotic solutions using the H-integral, which is a conservative integral, in conjunction with the
Externí odkaz:
https://doaj.org/article/4144e619eded48e2954e8fffc125f0eb
Autor:
Masaaki Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Masaya Kato, Toru Ikeda, Yutaka Hayama, Seiya Hagihara, Noriyuki Miyazaki
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:260-268
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3607df46af7d2e5de1433bc89e84b802
https://doi.org/10.5104/jiep.jiep-d-21-00114
https://doi.org/10.5104/jiep.jiep-d-21-00114
Autor:
Seiya Hagihara, Yutaka Hayama, Masaaki Koganemaru, Noriyuki Miyazaki, Tomoki Sakaguchi, Nobuyuki Shishido
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:560-571
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b14eef893cc2c1b2b153a53bfe1541f3
https://doi.org/10.5104/jiep.jiep-d-21-00004
https://doi.org/10.5104/jiep.jiep-d-21-00004
Publikováno v:
The Proceedings of The Computational Mechanics Conference. :7-09
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bae9fd8569a863f3ea88532a54913d4c
https://doi.org/10.1299/jsmecmd.2022.35.7-09
https://doi.org/10.1299/jsmecmd.2022.35.7-09
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 23:173-191
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fa17e4bcbd12ef9ec52e2b4679fe97f
https://doi.org/10.5104/jiep.23.173
https://doi.org/10.5104/jiep.23.173
Publikováno v:
SiC Power Module Design: Performance, Robustness and Reliability ISBN: 9781785619076
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::350f7a064ae0ae00fc1e0af4c7bd6a8f
https://doi.org/10.1049/pbpo151e_ch8
https://doi.org/10.1049/pbpo151e_ch8
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics. 7:1604-1614
Power modules are utilized for electric power control and play a key role in efficient energy conversion. A structural reliability problem of wire bonding, wire-liftoff, in power modules becomes important at high-temperature operation. Wire-liftoff i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efe07f99108f95b7376bc9a2e42d7e8b
https://doi.org/10.1109/jestpe.2019.2914244
https://doi.org/10.1109/jestpe.2019.2914244
Publikováno v:
The Proceedings of The Computational Mechanics Conference. :7-08
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78f49d1534d8d1d66491ee77fdbbb965
https://doi.org/10.1299/jsmecmd.2022.35.7-08
https://doi.org/10.1299/jsmecmd.2022.35.7-08
Publikováno v:
Journal of Electronic Packaging. 143
This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which ind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82be7f26ccbce78c73f58a6dc25caf68
https://doi.org/10.1115/1.4048038
https://doi.org/10.1115/1.4048038
Autor:
Yuto Kumagai, Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama, Toru Ikeda, Yoshiki Setoguchi, Masaaki Koganemaru
Publikováno v:
Microelectronics Reliability. 123:114185
One of the common reliability concern on most of power modules is a failure of its bonding. Stress, strain, and displacement fields around those bonding in power modules are required for highly-reliable design based on physically/mechanically based f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8204298a2fd005fe56b66ba82ddc8d97
https://doi.org/10.1016/j.microrel.2021.114185
https://doi.org/10.1016/j.microrel.2021.114185